Test Socket Fabrication via Integrated Probe Hole Drilling

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Solution Overview

Problem

Conventional methods for fabricating test sockets for high-frequency or high-speed semiconductor testing suffer from increased process errors and alignment issues as the number of probes increases, leading to deteriorated insertion loss, return loss, crosstalk, isolation, Z-Impedance, and inductance characteristics due to separate processes for forming probe accommodating and supporting holes.

Innovation Solution

A method of fabricating a test socket that forms probe accommodating and support holes in a single process by filling conductive base members with insulating material, allowing for accurate positioning of probes along central axes, and using a gap plate for alignment, thereby reducing errors and improving electrical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If probe accommodating holes and probe support holes are formed through separate processes, then the fabrication process can be simplified individually, but the alignment precision and manufacturing precision deteriorate as the number of probes increases

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidprobe alignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent combines the formation of probe accommodating holes and probe support holes into a single integrated process. The probe support holes are formed simultaneously with the probe accommodating holes through one drilling operation, eliminating the need for separate processes. This merging approach maintains alignment precision because both hole types are created in the same setup, ensuring their relative positions remain accurate even as the number of probes increases.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If multiple separate processes are used for forming probe holes and support holes, then each process can be optimized independently, but the overall process error and alignment error increase

Engineering Contradiction:
Improveprocess optimization flexibilityVSAvoidprocess error and alignment error
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent merges the formation of probe accommodating holes and probe support holes into a single drilling process. By using one drilling operation to create both types of holes simultaneously, the patent eliminates cumulative errors that would arise from multiple separate processes. The holes are formed in the same setup with consistent reference points, ensuring high alignment precision regardless of the number of probes.

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If probe supporting holes are formed on separate insulating support plates, then the structural support is improved, but the alignment between probe accommodating holes and probe support holes becomes more difficult to maintain

Engineering Contradiction:
Improvestructural support capabilityVSAvoidhole alignment accuracy
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent combines the probe accommodating holes and probe support holes into a single integrated structure formed through one drilling process. This integration ensures that the holes are precisely aligned with each other, as they are created in the same setup using consistent reference points. The structural support function is maintained through the integrated design of the conductive block that houses both hole types.

Inventive Principle:
Principle #5Merging (Combining)

4Productivity

If individual processes are used for forming probe holes and support holes, then the process steps can be performed independently, but the insertion loss, return loss, and other electrical characteristics deteriorate

Engineering Contradiction:
Improveprocess independenceVSAvoidelectrical characteristics
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent merges the formation of probe accommodating holes and probe support holes into a single drilling process. This integration ensures precise alignment between the holes, which is critical for maintaining good electrical characteristics. When the holes are accurately aligned, the probes are properly positioned, resulting in improved insertion loss, return loss, crosstalk, isolation, Z-impedance, and inductance characteristics.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240248118A1Test socket and method for fabricating the same
Publication Date: 2024.07.25 LEENO IND INC
  • US20240248118A1 patent drawing
  • US20240248118A1 patent drawing
  • US20240248118A1 patent drawing

AI summary

The disclosure relates to a test socket and a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a probe hole for accommodating the probe in a base member made of a conductive material, filling the probe hole with a resin as an insulating material to a predetermined depth from an upper surface of the base member to form a probe support member; and forming a first support hole for supporting one end portion of the probe in the probe support member in the probe hole to expose the one end portion of the probe.