Test Socket Pin With Inclined Portion For Semiconductor Packages
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Solution Overview
Problem
Existing test sockets for semiconductor packages lack an efficient mechanism for automatically contacting socket pins with terminals, requiring complex manufacturing processes and potentially influencing signal transmission due to non-insulating materials.
Innovation Solution
A test socket design featuring an actuator with a through-hole and a socket pin having an inclined portion, which is moved vertically by an elastic member to contact the terminal of the semiconductor package, reducing the number of components and simplifying manufacturing while ensuring signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex mechanism is used to bring socket pin into contact with terminal, then contact reliability is improved, but device complexity increases
Solution Approach 1:
The socket pin automatically contacts the terminal through its own elastic deformation when the semiconductor package is inserted. The inclined portion of the socket pin naturally guides itself into contact with the terminal without requiring external actuation mechanisms, achieving self-service contact establishment.
Solution Approach 2:
The socket pin is divided into functional segments: an inclined portion for guidance and contact initiation, a pin body for structural support, and a pin head for terminal contact. This segmentation allows each part to perform its specific function efficiently while simplifying the overall mechanism.
2Stability of the object's composition
If more components are used in test socket, then contact stability is improved, but manufacturing complexity increases
Solution Approach 1:
The socket pin combines multiple functions into a single integrated component: it provides mechanical support through its pin body, guides itself into position through the inclined portion, and establishes electrical contact through the pin head. This merging eliminates the need for separate guidance mechanisms and actuators, simplifying manufacturing while maintaining contact stability.
Solution Approach 2:
The inclined portion changes the geometric parameters of the socket pin, creating an oblique angle that transforms the contact mechanism from requiring precise external positioning to allowing natural self-alignment during insertion. This parameter change simplifies manufacturing tolerances and assembly processes.
3Force
If non-insulating materials are used for socket pin, then contact force is improved, but signal integrity deteriorates
Solution Approach 1:
The socket pin is made from composite or specially treated materials that combine electrical insulation properties with sufficient mechanical strength. This allows the pin to provide adequate contact force while simultaneously preventing signal leakage and maintaining signal integrity, resolving the contradiction between force and insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for automatic and stable contact of socket pins with semiconductor package terminals, simplifying the manufacturing process and maintaining signal integrity by using a reduced component count and insulating materials.
Implementation Method 1
The actuator may be vertically moved by elasticity of the elastic member
Data Source
AI summary
A test socket includes a base to receive a semiconductor package, an actuator in the base, the actuator including a through-hole, and a socket pin in the through-hole of the actuator, the socket pin contacting a terminal of the semiconductor package, wherein the socket pin includes a pin body, a pin head to contact the terminal of the semiconductor package, and an inclined portion inclined with respect to a longitudinal direction of at least an upper portion of the pin body, the pin head being connected to a top end of the inclined portion, and the pin body being connected to a bottom end of the inclined portion, wherein the inclined portion contacts at least a portion of an inner sidewall of the through-hole.