Semiconductor Test Socket Pressure Zoning for Warpage Contact
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Solution Overview
Problem
Integrated circuit packages often exhibit warpage due to differing coefficients of thermal expansion, leading to incomplete contact between probe pins and contact pads during testing, which can result in faulty device identification or damage from excessive force application.
Innovation Solution
A device tester with individually controllable pressure cylinders applies forces based on the pin count of the semiconductor die, using a combination of preliminary and testing pressures to ensure proper contact without causing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If excessive force is applied to ensure complete contact between probe pins and contact pads, then contact reliability is improved, but damage to the integrated circuit package occurs
Solution Approach 1:
The patent applies different forces to different regions of the integrated circuit package based on their individual warpage characteristics. Each region is pressed with a force tailored to its specific warpage magnitude, ensuring complete contact without applying excessive force uniformly across the entire package. This localized approach resolves the contradiction by matching the applied force to the actual contact requirements of each region.
Solution Approach 2:
The patent changes the force parameter dynamically based on the measured warpage of each region. By measuring the actual warpage magnitude and using this information to determine the appropriate pressing force, the system adjusts the force parameter to achieve optimal contact reliability while preventing damage. This parameter adaptation allows the system to respond to actual package conditions rather than using fixed excessive force.
2Device complexity
If uniform force is applied to all regions of the integrated circuit package, then device complexity is reduced, but contact precision deteriorates due to varying warpage magnitudes
Solution Approach 1:
The patent implements local quality by assigning different force characteristics to different regions based on their individual warpage measurements. Each region receives a customized force profile that matches its specific warpage characteristics, thereby achieving high contact precision without requiring an overly complex unified force application system. The system maintains manageable complexity by using modular regional control rather than a completely customized approach for each contact point.
3Reliability
If force is applied to correct warpage, then contact completeness is improved, but risk of damage increases
Solution Approach 1:
The patent employs feedback by measuring the actual warpage of each region before applying force, then using this measurement information to determine the appropriate force magnitude. This feedback loop ensures that the applied force is precisely calibrated to correct the measured warpage, achieving complete contact while minimizing the risk of damage. The system continuously monitors and adjusts based on actual package conditions rather than applying blind excessive force.
Solution Approach 2:
The patent changes the force parameter based on the measured warpage parameter of each region. By using the warpage measurement as input to determine the appropriate force magnitude, the system dynamically adjusts the force parameter to achieve complete contact while staying within safe limits. This parameter-based approach replaces guesswork with measured, controlled force application that targets only the necessary correction amount.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of damage to the integrated circuit package and the device tester while improving test accuracy by ensuring consistent and complete pin-to-pad contact.
Implementation Method 1
A device tester with individually controllable pressure cylinders applies forces based on the pin count of the semiconductor die
Data Source
AI summary
A test system and method of testing are provided. In some embodiments, a system for testing an integrated circuit package includes a device tester. The device tester includes a socket, a cylinder head unit engageable with the socket, and a pressure regulator. The socket includes a first pressure cylinder configured to engage a first region of the integrated circuit package and a second pressure cylinder configured to engage a second region of the integrated circuit package. The pressure regulator is configured to provide at gas at a first pressure to the first pressure cylinder and to provide the gas at a second pressure different than the first pressure to the second pressure cylinder.