Test Socket Probe Alignment via Integrated Coupling Block

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Solution Overview

Problem

Conventional methods for fabricating test sockets for high-frequency or high-speed semiconductor testing suffer from increased process and alignment errors as the number of probes increases, leading to deteriorated insertion loss, return loss, crosstalk, isolation, Z-Impedance, and inductance characteristics due to separate processes for forming probe accommodating and supporting holes.

Innovation Solution

A method involving the formation of a coupling block by integrating a conductive base member with an insulating member, where both the probe accommodating hole and support holes are created in a single process, allowing accurate positioning of signal probes along the central axis, thereby reducing alignment errors and enhancing electrical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If separate processes are used to form probe accommodating holes and probe supporting holes, then the fabrication process can be simplified, but alignment errors increase and manufacturing precision deteriorates

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidalignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent combines the formation of probe accommodating holes and probe supporting holes into a single integrated process. The support plate is positioned on the conductive block before forming the holes, ensuring that both types of holes are created with proper alignment in one operation, thereby eliminating alignment errors between separate processes while maintaining fabrication simplicity

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If the number of probes is increased, then testing capability is improved, but process error and alignment error increase

Engineering Contradiction:
Improvetesting capabilityVSAvoidalignment error
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent introduces insulating support plates as separate modular components that can be positioned on the conductive block before hole formation. Each support plate independently supports probe barrels, allowing the system to accommodate multiple probes while maintaining precise alignment through the modular structure, thus enabling testing capability expansion without increasing alignment errors

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves insertion loss, return loss, crosstalk, isolation, Z-Impedance, and inductance characteristics by ensuring precise alignment of signal probes, maintaining excellent electrical performance even with multiple probes.

Implementation Method 1

arranging an adhesive sheet between the base member and the insulating member and heating and pressing the adhesive sheet

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

filling a resin in the depressed portion, covering the depressed portion filled with the resin with a cover, curing the resin

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS12105133B2Method for fabricating test socket
Publication Date: 2024.10.01 LEENO IND INC
  • US12105133B2 patent drawing
  • US12105133B2 patent drawing
  • US12105133B2 patent drawing

AI summary

The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a coupling block by joining an insulating member of an insulating material to one surface of a base member of a conductive material, forming a probe accommodating hole for accommodating the probe in the coupling block and a first support hole for supporting one end portion of the probe, forming a second support hole in a cover member of an insulating material for supporting the other end portion of the probe, inserting the probe into the probe accommodating hole so that the one end portion of the probe is supported by the first support hole, and joining the cover member to the other surface of the base member so that the other end portion of the probe is supported by the second support hole.