Test Socket Segmented Bottom Board Prevents Warping
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Solution Overview
Problem
Existing test sockets for IC packages face issues with deformation and warping of the bottom board during surface mounting technology (SMT) due to differing coefficients of thermal expansion between metallic and plastic materials, which affects the reliability of IC package testing.
Innovation Solution
A test socket design featuring a bottom board with four separate clumps attached to its corners, made of metal, which cooperate with the board to form an imaginary sidewall around the IC package, allowing for independent expansion and preventing warping during soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-piece bottom board is used, then the structure is simple, but the board warps during SMT due to thermal expansion differences
Solution Approach 1:
The bottom board is divided into multiple independent parts: a plastic board and separate metal clumps positioned at corners or along edges. This segmentation allows each material to expand independently during thermal processes, preventing warping while maintaining structural simplicity.
2Ease of manufacture
If metallic and plastic materials are combined in a single piece, then manufacturing is easier, but warping occurs due to different CTE
Solution Approach 1:
The bottom board structure is segmented into a plastic board and separate metal clumps that are attached rather than integrated. This allows each material to be manufactured independently using optimal processes, then assembled together, maintaining ease of manufacture while eliminating warping issues.
Solution Approach 2:
The mounting portions serve as intermediary elements that connect the plastic board to the metal clumps. These intermediaries accommodate the different thermal expansion characteristics of the two materials, allowing them to work together without causing dimensional instability.
3Area of stationary object
If the bottom board is made large for IC package support, then the support area is sufficient, but warping increases due to thermal stress
Solution Approach 1:
The large bottom board is segmented into a plastic board with separate metal clumps distributed across its surface. This segmentation allows the large structure to accommodate thermal expansion differences across its extensive area, preventing warping while providing sufficient support area for large IC packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents warping of the bottom board during SMT, ensuring reliable electrical connection and testing of IC packages by accommodating thermal expansion differences between materials.
Implementation Method 1
the board will deforms and warp for the metallic and plastic material have different coefficient of thermal expansion (CTE)
Data Source
AI summary
A test socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a bottom board (10) and four separated clumps (20). The bottom board has a main body (11) having a rectangular shape and four mounting portions (12) integrally extending outwardly from four corners of the main body, respectively. The clumps are assembled upon the four mounting portions of the bottom board to cooperate with the bottom board to define a receiving space for receiving the IC package.