Test Socket Segmented Pedestal for Semiconductor Package Positioning
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Solution Overview
Problem
Miniaturization of semiconductor package terminals with narrower pitches and more contacts leads to positional displacement and improper seating during testing, causing test failures.
Innovation Solution
A test socket design featuring a central pedestal with insertion holes and a circumferential pedestal separated by a space wider than the insertion holes, along with a circumferential contact portion to stabilize the package and prevent positional errors, and pressing pieces to secure the package during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the semiconductor package terminals are miniaturized with narrower pitches and more contacts, then the terminal density and integration are improved, but the positional accuracy and proper seating onto insertion holes deteriorate
Solution Approach 1:
The pedestal is segmented into a central pedestal and a circumferential pedestal separated by a space. This segmentation allows the central region to provide precise insertion holes for terminal positioning while the circumferential region provides additional support without interfering with the narrow-pitch terminals, thus resolving the contradiction between high terminal density and positional accuracy
Solution Approach 2:
Different regions of the pedestal are given different functions: the central pedestal region contains precisely positioned insertion holes for terminal guidance, while the circumferential pedestal region provides broader support. This local differentiation allows the system to accommodate both high-density terminals and maintain positioning accuracy
2Ease of operation
If the bottom surface of the semiconductor package partially contacts the pedestal due to positioning failure, then the seating process continues, but the terminals are inserted into improper insertion holes causing test failure
Solution Approach 1:
The space between the central and circumferential pedestals acts as a cushioning zone. When partial contact occurs, this space prevents catastrophic misalignment by providing a transition region that allows the package to settle into the correct position without forcing terminals into wrong holes, thus maintaining reliability while allowing ease of seating
3Manufacturing precision
If the circumferential pedestal is provided separated by space from the central pedestal, then the terminal positioning guidance is improved, but the structural complexity increases
Solution Approach 1:
The circumferential pedestal serves multiple functions: it provides structural support, defines the space for positioning guidance, and prevents excessive movement. This multi-functionality justifies the increased structural complexity by delivering multiple benefits from a single design element
Data Source
AI summary
A test socket includes a pedestal. The pedestal includes a central pedestal including a central contact portion coming in contact with a central region of a bottom surface of a semiconductor package and a plurality of insertion holes formed to correspond to a plurality of solder balls projecting from the bottom surface of the semiconductor package, so as to allow the solder balls to be inserted into respective insertion holes. The pedestal further includes a circumferential pedestal separated from the central pedestal by a space having an opening width larger than a diameter of the insertion hole and including a circumferential contact portion coming in contact with a circumference of the bottom surface of the semiconductor package.