Semiconductor Test Socket Shielding and Elastic Layer Design
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Solution Overview
Problem
Conventional pogo pin type test sockets for semiconductor devices face issues with contact failure, damage from misalignment, elastic errors, and high manufacturing complexity, especially for high-density and low-pitch test sockets, leading to reliability concerns and increased costs.
Innovation Solution
A semiconductor device test socket with a coaxial shielding structure made of conductive material around each contactor, using MEMS technology, and an elastic layer to support the contactor, which enhances signal integrity and durability by minimizing signal interference and shape deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pogo pin type test socket is used, then contact between probe and ball terminal can be achieved, but contact failure and damage from misalignment occur reducing reliability
Solution Approach 1:
The test socket structure is segmented into multiple functional layers including a base layer, connection layer with conductive patterns, and probe assembly layer. This segmentation allows each layer to independently perform its function (support, electrical connection, mechanical contact) reducing the propagation of errors and improving overall contact reliability
Solution Approach 2:
The patent employs an elastic layer positioned between the probe and the ball terminal that provides pre-compression and shock absorption. This elastic cushioning compensates for misalignment and prevents damage before it occurs, thereby improving contact reliability while reducing harmful effects of misalignment
2Measurement precision
If pogo pin type test socket is used, then electrical characteristic test can be performed, but elastic error of pogo pin and gold plating film defect make it difficult to secure test reliability
Solution Approach 1:
The patent uses composite material structures including the elastic layer combined with conductive materials, and multi-layer connection structures with different material properties. This composite approach maintains stable electrical characteristics (contact resistance, impedance) by compensating for the elastic errors and plating defects through material property coordination
Solution Approach 2:
The elastic layer provides pre-compression that compensates for dimensional variations and plating thickness variations before electrical contact is made. This beforehand cushioning ensures stable electrical characteristics and maintains test reliability despite manufacturing variations
3Quantity of substance
If pitch of pogo pin is reduced for high-density test socket, then manufacturing complexity and assembly difficulty increase significantly
Solution Approach 1:
The patent merges multiple functions into integrated structures: the connection layer combines electrical connection patterns with mechanical support functions, and the probe assembly integrates the elastic layer, conductive patterns, and contact structures into a unified component. This merging reduces the number of separate manufacturing and assembly steps, making high-density test sockets easier to manufacture
Solution Approach 2:
The base layer and connection layer are designed with universal functions that serve multiple purposes: structural support, electrical connection, and alignment reference. This multi-functionality reduces the need for additional specialized components, simplifying manufacturing and assembly of high-density configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced test reliability and durability by restraining signal interference, noise, and distortion, while allowing for high-speed testing of high-frequency devices with fine pitch contactors, and reduces manufacturing complexity and costs.
Implementation Method 1
a shielding structure which is formed by sequentially laminating a conductive material on an outer edge of the contactor in a coaxial structure using micro electro mechanical system (MEMS) technology and is electrically connected to a ground
Implementation Method 2
an elastic layer which is filled in a space between the contactor and the shielding structure so that the contact terminal of the contactor is exposed after forming the contactor, the shielding structure, and the connection film
Data Source
AI summary
A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.