Test Socket With Thermoelectric Temperature Control
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Solution Overview
Problem
Conventional methods for testing semiconductor packages at various temperatures are inefficient, taking a long time to heat or cool the test chamber, resulting in inaccurate temperature control and low reliability of the test process.
Innovation Solution
A test socket equipped with a thermoelectric element and heat transfer member that rapidly sets and maintains desired temperatures by emitting or absorbing heat, combined with a heat spreader and fan for efficient heat dissipation, allowing direct temperature control of the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate temperature controller provides hot or cold air to the test chamber to set various temperatures, then the test chamber can reach desired test temperatures, but it takes a very long time to heat or cool the test chamber
Solution Approach 1:
The patent introduces a heat transfer member as an intermediary between the thermoelectric element and the semiconductor package. This mediator enables direct thermal coupling, allowing heat to be transferred rapidly from the thermoelectric element to the package without requiring gradual heating or cooling of the entire test chamber environment.
Solution Approach 2:
The patent replaces the conventional mechanical/thermal system (separate temperature controller heating or cooling air in the test chamber) with a direct thermoelectric cooling/heating system. The thermoelectric element converts electrical energy directly into thermal energy at the location of the semiconductor package, eliminating the need for gradual chamber temperature adjustment.
2Temperature
If the semiconductor package is indirectly provided with a desired test temperature using air from outside the test chamber, then the package can be tested at various temperatures, but the inner temperature of the test chamber has large deviation resulting in low reliability
Solution Approach 1:
The patent applies local quality by providing temperature control directly at the location of the semiconductor package rather than uniformly controlling the entire test chamber. The thermoelectric element and heat transfer member create a localized thermal environment around the package, ensuring precise temperature control where needed while allowing the rest of the chamber to maintain ambient conditions.
Solution Approach 2:
The heat transfer member serves as a thermal intermediary that directly couples the thermoelectric element to the semiconductor package. This intermediary ensures efficient heat transfer and minimizes temperature deviations, providing accurate and reliable temperature control directly at the package interface rather than relying on indirect air heating or cooling of the entire chamber.
3Productivity
If the thermoelectric element directly controls the temperature of the semiconductor package, then rapid and accurate temperature setting is achieved, but additional components (heat transfer member, heat spreader, fan) are required
Solution Approach 1:
The patent merges multiple functions into the test socket structure. The heat transfer member, heat spreader, and fan are integrated into the socket body, combining temperature control, heat dissipation, and airflow management functions into a single unified component rather than separate external systems.
Solution Approach 2:
The test socket is designed with multi-functionality, serving not only as a mechanical holder for the semiconductor package but also as an integrated temperature control system. The socket includes thermoelectric elements for heating/cooling, heat transfer members for thermal coupling, heat spreaders for thermal distribution, and fans for airflow, making it a universal temperature-controlled testing platform.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and accurate temperature setting for testing semiconductor packages, significantly reducing test time and improving the reliability of electrical characteristic evaluations.
Implementation Method 1
a thermoelectric element arranged in the socket body to emit heat and absorb heat in accordance with current directions
Implementation Method 2
a heat transfer member arranged between the object and the thermoelectric element to transfer a heat generated from the object to the thermoelectric element
Implementation Method 3
a fan for sucking the heat of the thermoelectric element
Data Source
AI summary
A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.