Semiconductor Test Socket Pressing Mechanism for Uniform IC Contact
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Solution Overview
Problem
Conventional socket devices struggle to apply uniform pressing force to integrated circuits (ICs) during testing, particularly for LGA-type or combination-type ICs, and lack integration capabilities for heating packages like heat sinks or heat dissipation fans.
Innovation Solution
A socket device with a contact module and a pusher module that includes a lead frame, pressurizing parts with floating hinge axes, cam shafts, and a handle mechanism to apply uniform pressure, allowing for the integration of heating packages such as heat sinks and cooling fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a strong physical force is applied to an IC with many leads, then reliable electrical contact is achieved, but the IC may be damaged due to excessive pressure
Solution Approach 1:
The pressing force is segmented and distributed through multiple pressing members (first pressing member and second pressing member) that contact different regions of the IC. Each pressing member applies localized pressure, and the combined effect provides sufficient total force for reliable contact without concentrating excessive force at any single point that could damage the IC.
Solution Approach 2:
Different regions of the IC receive different pressing forces tailored to their specific requirements. The pressing members are positioned to apply force at optimal locations, and the force distribution is optimized so that critical areas receive appropriate pressure for contact reliability while non-critical areas receive less pressure to avoid damage.
2Ease of operation
If a rotary-type handle mechanism is used for IC testing, then the testing function is achieved, but heating packages cannot be installed
Solution Approach 1:
The device structure is designed with multi-functionality, allowing it to serve both as an IC testing device and as a platform that can accommodate heating packages. The pressing mechanism and structural layout are configured so that heating packages can be installed in available spaces without interfering with the testing operations, enabling the device to perform multiple functions.
3Quantity of substance
If the number of IC leads increases, then testing capability is improved, but lead pitch becomes narrower and IC thickness reduces
Solution Approach 1:
The pressing mechanism addresses the challenges of narrow lead pitch and reduced IC thickness by operating in the vertical dimension. The pressing members apply force from above, allowing the device to accommodate thinner ICs without requiring horizontal space that would be constrained by narrow lead pitch. This vertical pressing approach enables testing of high-lead-count ICs with fine pitch and reduced thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures uniform pressing force on ICs, preventing damage and facilitating the installation of heating or cooling components, enhancing testing reliability and efficiency.
Implementation Method 1
a pressurizing part assembled to the lead frame with two floating hinge axes parallel to each other and elastically supported against the lead frame to be movable up and down to elastically pressurize the IC
Implementation Method 2
first and second cam shafts provided in the respective floating hinge axes to adjust a vertical height of the pressurizing part depending on a rotation angle thereof
Implementation Method 3
a heating package such as a heat sink or a heat dissipation fan
Implementation Method 4
a heating package such as a heat sink or a heat dissipation fan
Data Source
Figure 1
Figure 2(a)~2(b)
Figure 3
AI summary
The present invention relates to a socket device for a semiconductor element test, used to test a semiconductor element, the device comprising: a contact module (100) having a semiconductor element seated thereon and comprising a plurality of contacts (110) for electrically connecting a terminal of the semiconductor element and a terminal of a PCB; and a pusher module (200) which has a latch (211), and is inserted to the upper part of the contact module (100) and assembled thereto, and presses the semiconductor element, wherein the pusher module (200) comprises: a lead frame (210) having the latch rotatably provided thereon; pressing parts (220) (230) which have two movable hinge shafts (C21) (C22) that are next to each other, and which are assembled to the lead frame (210) and elastically supported with respect to the lead frame (210) so as to be vertically movable and elastically press the semiconductor element; a first and a second cam shaft (240) (250) which are provided on the respective movable hinge shafts (C21) (C22) and adjust the height of the pressing parts (220) (230) according to the rotation angle; a rotatable handle (260) which is integrally fixed to the first cam shaft (240); a rotatable lever (270) which is integrally fixed to the second cam shaft (250); and a link (280) two ends of which are connected to the handle (260) and the lever (270) in a freely rotatable manner.