Test Socket Warpage Compensation via Variable Plunger Thickness
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Solution Overview
Problem
Conventional test sockets fail to maintain stable contact with warped semiconductor packages, leading to inconsistent electrical testing, reduced accuracy, and increased risk of damage to both the socket pins and the device under test due to warpage-induced uneven contact pressures.
Innovation Solution
A test socket design featuring socket pins with upper plungers of varying thicknesses to accommodate different warpage conditions, ensuring consistent contact strokes and reducing the risk of over-stroke damage, thereby enhancing testing reliability and lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional test sockets with uniform pogo pins are used, then the structure is simple and manufacturing is easy, but contact stability deteriorates due to warpage-induced uneven contact pressures
Solution Approach 1:
The patent applies local quality by varying the thickness of upper plungers based on their position in the socket array. Socket pins corresponding to peripheral terminals use thicker upper plungers to compensate for upward warpage, while central terminals use thinner upper plungers. This localized adjustment ensures uniform contact pressure across all terminals despite device warpage, directly improving contact stability without requiring complete redesign of the entire socket structure.
Solution Approach 2:
The patent implements parameter changes by modifying the thickness parameter of upper plungers according to their positional coordinates in the socket array. Specifically, the thickness varies from center to periphery to compensate for warpage-induced height differences. This parameter adjustment allows the test socket to maintain reliable electrical contact across warped device surfaces while preserving the overall simple pogo pin structure.
2Measurement precision
If uniform thickness upper plungers are used, then manufacturing is simplified, but measurement precision deteriorates due to inconsistent contact strokes
Solution Approach 1:
The patent applies local quality by varying the thickness of upper plungers based on their position in the socket array. Socket pins corresponding to peripheral terminals use thicker upper plungers to compensate for upward warpage, while central terminals use thinner upper plungers. This localized adjustment ensures uniform contact pressure across all terminals despite device warpage, directly improving contact stability without requiring complete redesign of the entire socket structure.
Solution Approach 2:
The patent implements parameter changes by modifying the thickness parameter of upper plungers according to their positional coordinates in the socket array. Specifically, the thickness varies from center to periphery to compensate for warpage-induced height differences. This parameter adjustment allows the test socket to maintain reliable electrical contact across warped device surfaces while preserving the overall simple pogo pin structure.
3Reliability
If conventional uniform pogo pins are used, then device complexity is low, but the risk of over-stroke damage increases due to uneven contact pressures from warpage
Solution Approach 1:
The patent applies local quality by varying the thickness of upper plungers based on their position in the socket array. Socket pins corresponding to peripheral terminals use thicker upper plungers to compensate for upward warpage, while central terminals use thinner upper plungers. This localized adjustment ensures uniform contact pressure across all terminals despite device warpage, directly improving contact stability without requiring complete redesign of the entire socket structure.
Solution Approach 2:
The patent implements beforehand cushioning by pre-adjusting the thickness of upper plungers to compensate for expected warpage effects. This preventive measure ensures that even when devices with warpage are tested, the contact pressure remains within safe limits, preventing over-stroke damage to both the test socket and the device under test before the testing process begins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable signal transmission and improved test accuracy by ensuring uniform contact pressure across all terminals, extending the lifespan of the test socket and preventing damage to the device under test.
Implementation Method 1
a lower plunger, which can come into contact with the electrode pad, supported by an elastic force
Data Source
AI summary
The test socket according to the present disclosure is configured to allow terminals of a warped device under test to comes into contact with electrode pads of a tester, which generates a test signal, to perform an electrical test for the device under test, this test socket is configured such that, by the upper plungers, which are separate components from the barrel assembly and have different thicknesses, the terminals of the warped device under test can come simultaneously into contact with the socket pins, thereby applying the same stroke to all the socket pins.