Test Structures for Multi-Connection Lead Continuity
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Solution Overview
Problem
Existing continuity tests for electronic devices with multiple-connection leads cannot detect interruptions in only part of the connection wires, leading to defective devices passing open/short tests and requiring costly parametric or functional tests, which complicates failure determination and increases production costs.
Innovation Solution
Incorporating test structures between multiple-connection leads and single-connection leads, allowing for a configurable test condition to verify the integrity of electrical connections, which can be switched to an operative condition to avoid interfering with normal device operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a multiple-connection lead is used to reduce the number of leads, then the footprint of the electronic device is reduced, but the ability to detect partial connection wire interruptions is lost
Solution Approach 1:
The patent divides the testing function into separate test structures for each terminal connected to the multiple-connection lead. Each test structure independently tests the connection wire to its specific terminal, allowing detection of partial interruptions while maintaining the compact multiple-connection lead structure.
Solution Approach 2:
The patent introduces test structures as intermediary elements between the multiple-connection lead and the testing equipment. These test structures enable indirect testing of connection wires by providing accessible test terminals that can be probed without disrupting the normal multiple-connection lead functionality.
2Device complexity
If traditional continuity tests are used on multiple-connection leads, then the test structure is simple, but partial connection wire interruptions cannot be detected
Solution Approach 1:
The testing approach is segmented into multiple independent test structures, each dedicated to testing a specific terminal's connection wire. This segmentation enables precise detection of which specific connection is interrupted while keeping each individual test structure relatively simple.
Solution Approach 2:
The patent applies testing actions selectively to specific terminals rather than requiring comprehensive testing of all connections simultaneously. Each test structure performs a focused partial test on its associated terminal's connection wire, achieving sufficient detection precision without excessive overall test complexity.
3Loss of information
If parametric or functional tests are performed on defective devices, then the cause of failure can be determined, but test costs increase
Solution Approach 1:
The patent performs preliminary continuity testing using the integrated test structures before conducting more expensive parametric or functional tests. This preliminary action identifies and eliminates defective devices early in the testing sequence, preventing wasteful expenditure on subsequent costly tests for devices that will ultimately fail anyway.
Solution Approach 2:
The patent applies a partial testing approach by first performing simple continuity tests on specific connection wires using the test structures. Only devices that pass this preliminary partial test proceed to full parametric or functional testing, thereby reducing the overall number of expensive tests required and optimizing resource allocation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables early detection of defective devices with partial connection wire interruptions, reducing test costs and improving production quality by facilitating the identification of failure causes, especially in devices with non-volatile memories.
Implementation Method 1
a continuity test may be used to verify the integrity of the connection wires between the terminals and the leads
Data Source
AI summary
An electronic device includes an electronic component having terminals including a set of first terminals and a set of second terminals, a protective package embedding the electronic component, leads exposed from the protective package including a set of first leads and a set of second leads, for each first lead a first electrical connection inside the protection package between the first lead and a corresponding one of the first terminals, and for each second lead electrical connections inside the protective package each one between the second lead and a corresponding one of the second terminals. For each second lead the electronic component includes test structures, each being coupled between a corresponding one of the second terminals connected to the second lead and a corresponding test one of the first terminals connected to a test one of the first leads.