Test Substrate Auto-Teaching for Wafer Entry Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, it is challenging to determine if a wafer is properly positioned within a vacuum chamber without physically installing a camera, leading to potential human error and reduced yield due to difficulties in measuring the wafer's position, especially in the Z-axis direction.
Innovation Solution
A substrate processing apparatus with a test substrate connected to a robot arm, equipped with distance measuring sensors that scan the processing apparatus to determine the substrate-accessible region, allowing for precise position control and auto-teaching of the wafer's entry into the chamber without affecting the internal space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a camera is physically installed inside the vacuum chamber to determine wafer position, then measurement capability is improved, but device complexity and space occupation increase
Solution Approach 1:
A magnetic field is introduced as an intermediary to transmit position information from the wafer to external sensors. The wafer contains a magnetic element that generates a magnetic field detectable by magnetic sensors positioned outside the vacuum chamber, enabling non-contact position measurement without occupying internal chamber space
Solution Approach 2:
The patent replaces physical/optical measurement systems (camera) with a magnetic field-based sensing system. Magnetic sensors detect the position of the magnetic element on the wafer through the vacuum chamber wall, substituting mechanical/optical components with a field-based measurement approach that does not require internal space
2Device complexity
If manual determination of wafer position is used, then device complexity is reduced, but measurement precision and reliability deteriorate
Solution Approach 1:
The wafer itself provides the measurement signal through its magnetic element. The magnetic field generated by the wafer's magnetic element serves as the measurement signal, eliminating the need for external active sensors on the wafer while enabling automatic position detection
Solution Approach 2:
The system establishes a feedback loop where magnetic sensors continuously detect the wafer's position through the magnetic field, and this position information is fed back to the control system for real-time position correction and automated control, replacing manual determination with automated feedback-based control
3Ease of manufacture
If sensors are installed outside the processing unit to measure wafer position, then ease of manufacture is improved, but measurement capability deteriorates due to inability to detect Z-axis position correction
Solution Approach 1:
The magnetic field acts as an intermediary that penetrates the vacuum chamber wall, allowing magnetic sensors positioned outside the chamber to detect the Z-axis position of the wafer. The magnetic field transmits position information through the chamber wall without requiring physical contact or internal sensor installation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate and automated positioning of the wafer within the vacuum chamber, reducing human error and improving yield by allowing Z-axis position correction without the need for additional sensors inside the chamber, thus enhancing work efficiency.
Implementation Method 1
a distance measuring sensor connected to the test substrate, and measuring a distance from the processing apparatus in the first direction while scanning the processing apparatus in a predetermined second direction
Data Source
AI summary
The present disclosure may provide an auto-teaching method and apparatus using a distance measuring sensor a semiconductor manufacturing facility having a transfer robot including the same, and a substrate processing apparatus including a test substrate according to an embodiment of the present disclosure, may include: a test substrate connected to a robot arm and entering a processing apparatus in a first predetermined direction; a distance measuring sensor connected to the test substrate, and measuring a distance from the processing apparatus in the first direction while scanning the processing apparatus in a predetermined second direction; and a position control unit determining a region in which a substrate may enter the processing apparatus in the second direction, based on predetermined processing apparatus-related information and a measured result of the distance measuring sensor.