Electronic Testbed Board Via-Hole and Mounting Hole Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing testbeds for electronic circuits face inaccuracies in positioning nails due to variations in copper coating thickness within via-holes, leading to improper alignment and contact with device under test (DUT), resulting in incorrect testing results and costly rework or re-fabrication.
Innovation Solution
The method involves drilling precise mounting through-holes for receptacles and adjacent via-holes to establish electrical connections, allowing for separate mechanical and electrical functions, reducing the need for precise copper coating thickness and improving nail positioning accuracy by using conductive landing pad extensions with a gap for soldering connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper coating is applied to via-holes to provide electrical connections, then electrical connectivity is achieved, but variations in coating thickness cause positioning inaccuracies of nails
Solution Approach 1:
The invention separates the electrical connection function from the mechanical positioning function by using two distinct types of holes: via-holes for electrical connectivity and mounting through-holes for mechanical positioning. This segmentation eliminates the interference between copper coating variations and positioning accuracy.
Solution Approach 2:
The invention extracts the mechanical positioning function from the via-holes by introducing separate mounting through-holes. The via-holes are dedicated solely to electrical connections, while mounting through-holes handle mechanical positioning, removing the source of positioning errors.
2Reliability
If via-holes are drilled and copper coated to connect conductive layers, then electrical pathways are established, but the process becomes complex and time-consuming
Solution Approach 1:
The manufacturing process is segmented into distinct steps: drilling via-holes for electrical connections, drilling separate mounting through-holes for mechanical positioning, and selective copper coating only on via-holes. This segmentation simplifies process control and reduces complexity.
Solution Approach 2:
Copper coating is applied locally only to via-holes that require electrical connections, rather than uniformly to all holes. This selective application reduces material usage and simplifies the plating process by focusing only on necessary areas.
3Manufacturing precision
If copper coating thickness is controlled precisely to ensure accurate nail positioning, then positioning accuracy improves, but manufacturing complexity and cost increase
Solution Approach 1:
The invention removes the requirement for precise copper coating thickness control by extracting the positioning function to separate mounting through-holes. The via-holes are drilled to precise dimensions and coated with copper, but the positioning accuracy comes from the mounting through-holes, not the copper thickness.
Solution Approach 2:
The functional separation allows via-holes to be optimized for electrical connectivity with standard copper coating processes, while mounting through-holes provide mechanical positioning without requiring precise coating control. This eliminates the need for complex thickness control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of nail positioning and reduces manufacturing complexities, leading to improved testbed functionality and reduced rework costs by ensuring accurate electrical connections without the need for precise copper coating thickness control.
Implementation Method 1
electrically connecting conductive layers at the one or more via-holes by applying a conductive coating to the inner walls of the one or more via-holes
Implementation Method 2
electrically connecting the mounted receptacle to the conductive layers at the one or more via-holes by soldering the gap between the landing pad extension and the mounted receptacle
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
There is disclosed an electronic testbed, an electronic testbed board, and a method for positioning receptacles (112) for nails in the electronic testbed board. In an embodiment, the electronic testbed board includes a mounting through-hole for mounting a receptacle (112) for a nail. The mounting through-hole is drilled to a suitably precise diameter for mounting the receptacle substantially perpendicular to the testbed board. One or more via-holes (410) are located adjacent the mounting through-hole, and are adapted to allow an electrical connection between any conductive layers provided at the one or more via-holes. The receptacle (112) may be mounted more accurately and the electronic test bed may be built more accurately by separating the functions of the via-holes and the mounting through-hole.