High Speed Tester Interface for Thermal Chamber Signal Integrity
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Solution Overview
Problem
Conventional electronic device testing systems face challenges with high-speed testing of devices under test (DUTs) due to signal integrity issues over long distances and inefficient space utilization in thermal chambers, as well as the need for system downtime during DUT swapping.
Innovation Solution
A high-speed tester architecture that allows for horizontal stacking of DUTs within the thermal chamber and enables hot swapping and hot plugging, utilizing a system with a tester module, cables, and connectors to transmit test signals through a thermal chamber wall interface, using conductive traces and interposers to maintain signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional testing systems use long-distance signal transmission to test DUTs in thermal chambers, then testing can be performed, but signal integrity deteriorates at high speeds
Solution Approach 1:
The patent transitions from vertical/direct signal transmission through the chamber wall to horizontal signal transmission along the chamber wall surface. The DUTs are stacked horizontally with connectors positioned at different heights, allowing signals to travel horizontally along the wall rather than vertically through long cables, thereby maintaining signal integrity at high speeds.
Solution Approach 2:
The patent introduces connectors as intermediary elements that physically contact the DUTs and provide localized signal transmission points. These connectors act as mediators between the test signals and the DUTs, enabling high-speed communication without requiring long-distance cable transmissions through the thermal chamber.
2Adaptability or versatility
If DUTs are swapped in conventional systems, then device replacement is possible, but system downtime occurs
Solution Approach 1:
The patent implements hot-swappable connectors that are pre-configured and ready for immediate connection. The connector design allows DUTs to be replaced without powering down the system, as the electrical connections are already prepared and can seamlessly accept or release DUTs, eliminating downtime associated with device swapping.
3Quantity of substance
If thermal chamber space is utilized conventionally, then DUTs can be tested, but space utilization is inefficient
Solution Approach 1:
The patent utilizes vertical stacking of DUTs in addition to horizontal arrangement, effectively using three-dimensional space within the thermal chamber. By positioning connectors at different heights and stacking DUTs vertically on the same horizontal plane, the system maximizes the number of DUTs that can be tested simultaneously without increasing the horizontal footprint.
Solution Approach 2:
The patent implements a nested arrangement where multiple DUTs are stacked vertically one above another, with each DUT connected to connectors at its respective height level. This nesting approach allows multiple devices to occupy the same horizontal space at different vertical levels, significantly improving space utilization.
Data Source
AI summary
A tester system is disclosed. The tester system comprises a tester module operable to generate test signals for testing a plurality of DUTs. It also comprises a plurality of cables operable to communicatively couple the tester module with a tray comprising the plurality of DUTs through a thermal chamber wall interface. Further, it comprises a plurality of connectors in contact with the tray, wherein the plurality of connectors is operable to provide an interface between the plurality of cables and conductive traces on the tray, and further wherein each of the plurality of connectors is operable to pass a respective subset of the test signals to each DUT on the tray via the conductive traces.