Electronics Tester Slot Assemblies for Independent Thermal Control
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Solution Overview
Problem
Existing microelectronic circuit testing methods lack efficient and controlled temperature management and power supply mechanisms, which are crucial for identifying defects and ensuring the performance of microelectronic devices during early stage manufacture.
Innovation Solution
A tester apparatus with a frame, slot assemblies, electrical conductors, temperature detectors, and a thermal controller that allows for precise temperature management and power supply to microelectronic devices, enabling effective testing and performance measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature management is not implemented, then the testing process is simpler, but device performance and defect identification are compromised
Solution Approach 1:
The testing system is divided into multiple slot assemblies, each capable of independent temperature control. This segmentation allows parallel testing of multiple devices at different temperatures, improving reliability while managing complexity through modular design
Solution Approach 2:
Temperature detectors and thermal controllers are introduced as intermediary components between the slot assemblies and the testing process. These intermediaries enable precise temperature management, ensuring device performance without requiring complex manual intervention
2Productivity
If multiple wafers are tested simultaneously, then productivity increases, but temperature control complexity increases
Solution Approach 1:
The system uses multiple independent slot assemblies that can be configured in different patterns (e.g., 4x4, 8x2). Each slot assembly operates independently with its own temperature control, enabling parallel processing of multiple wafers while maintaining manageable complexity through modular architecture
Solution Approach 2:
The slot assemblies are designed to be universal and reconfigurable, allowing the same hardware platform to test different numbers and types of wafers. This multi-functionality increases productivity across different testing scenarios without proportionally increasing system complexity
3Manufacturing precision
If precise temperature control is implemented, then manufacturing precision improves, but energy consumption increases
Solution Approach 1:
Temperature control is applied locally at each slot assembly rather than uniformly across the entire system. This allows precise temperature control where needed (at the wafer level) while reducing energy consumption by not heating or cooling unnecessary areas
Solution Approach 2:
The system dynamically adjusts temperature parameters based on testing requirements. Different slot assemblies can operate at different temperatures simultaneously, and temperatures can be changed during the testing process, optimizing both precision and energy efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and efficient method for testing microelectronic devices by ensuring precise temperature control and power supply, thereby identifying defects early and ensuring device performance.
Implementation Method 1
at least one temperature modification device, which, when operated causes a transfer of heat to or from the wafers
Implementation Method 2
at least one thermal controller that controls the transfer of heat based on the temperatures of the wafers detected by the temperature detectors
Implementation Method 3
a temperature detector in proximity to the respective wafer to detect a temperature of the respective wafer
Implementation Method 4
a power supply connected through the electrical conductors to the wafers in the testing stations and providing at least power to each microelectronic device
Data Source
AI summary
A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.