Testing Apparatus Air Wall Preheating for Chip Temperature Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing testing apparatuses face challenges in maintaining favorable temperature stability for preheated chips during testing, leading to potential inaccuracies in sensitive tests and reduced yield due to heat dissipation in open environments.
Innovation Solution
A testing apparatus with a preheating unit that forms an air wall using a gas generator and a blocking mechanism, creating a heat preservation space to reduce heat dissipation and maintain temperature stability, allowing chips to be transported effectively between work stations for preheating and testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If preheating is performed in an open environment, then the testing apparatus can freely transport chips between work stations, but the preheated chips cannot achieve favorable temperature stability due to heat dissipation
Solution Approach 1:
An air wall is introduced as an intermediary between the heating device and the external environment. The air wall acts as a thermal barrier that reduces heat dissipation while allowing the preheating unit to remain accessible for chip transportation. The gas generator creates a controlled air flow that forms this protective barrier without physically enclosing the workspace.
Solution Approach 2:
The patent creates a controlled air environment around the heating device that acts as an insulating layer. By controlling the air flow and pressure, the system establishes a thermal environment that protects the preheated chips from rapid heat dissipation to the external open environment, while still allowing mechanical access for chip handling.
2Temperature
If a closed heat preservation structure is used, then temperature stability is improved, but chip transportation between work stations is restricted
Solution Approach 1:
Instead of using a solid physical enclosure, the patent employs an air wall as a mediator that provides thermal insulation while maintaining operational accessibility. The air flow barrier allows robotic arms and chip carriers to pass through the preheating zone without physical obstruction, combining the benefits of thermal protection with operational freedom.
Solution Approach 2:
The patent replaces a mechanical physical enclosure with a fluid-based air wall system. This substitution eliminates the need for solid walls that would obstruct chip transportation, while still achieving the desired thermal insulation effect through controlled air flow and pressure differentials.
3Device complexity
If the heating device operates in an open environment, then device complexity is reduced, but heat dissipation increases leading to poor temperature stability
Solution Approach 1:
The patent uses pneumatic principles by employing a gas generator to create a controlled air flow that forms the air wall. This pneumatic system provides thermal insulation without requiring complex solid structural enclosures, maintaining relative simplicity while effectively reducing heat dissipation through fluid-based thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains temperature stability for preheated chips, improving test yield and practicability by reducing heat dissipation and enabling free transportation under heat preservation across work stations.
Implementation Method 1
The gas generator is configured to discharge air toward the base to form an air wall
Implementation Method 2
The heating device is arranged in the heat preservation space
Data Source
AI summary
A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.