Testing Apparatus Flat Structure Thermal Conduction

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Solution Overview

Problem

Conventional memory chip testing apparatuses struggle to accurately control temperature across all memory chips, leading to inconsistent testing results due to uneven temperature distribution in high or low temperature environments.

Innovation Solution

A testing apparatus featuring a chip carrying device with electrically connecting units and a pressing device, including a temperature adjusting assembly with a flat structure and fluid channel, allows for precise temperature control by abutting the flat structure against the chips to ensure uniform testing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a hot air blower is used to increase the oven temperature to a predetermined high temperature, then the memory chips can be tested in a high temperature environment, but the temperature of each region of the oven cannot be accurately controlled, causing inconsistent testing results

Engineering Contradiction:
Improvetesting temperature control accuracyVSAvoidtemperature distribution uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent applies local quality by transitioning from a uniform hot air blower approach to individualized temperature control for each chip testing position. Each temperature controlling assembly provides localized temperature regulation, ensuring that each chip experiences the precise predetermined temperature required for accurate testing, rather than relying on general oven heating that creates temperature variations across different regions.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If the memory chips are tested in an oven with hot air blower, then high temperature testing can be achieved, but not all memory chips can be tested under the predetermined high temperature, causing inaccurate testing results

Engineering Contradiction:
Improvetemperature environment adaptabilityVSAvoidtesting result accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent applies segmentation by dividing the temperature control system into multiple independent temperature controlling assemblies, with each assembly responsible for a specific chip testing position. This segmentation allows each position to be independently controlled and adjusted to the predetermined high temperature, ensuring that all chips regardless of position can be tested under consistent and accurate temperature conditions.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus ensures that all memory chips are tested under the same temperature, improving the accuracy of testing results by maintaining consistent temperature across the chips during high or low temperature testing.

Implementation Method 1

an elastic assembly, which has one end fixed to the lift structure and the other end fixed to the supporting structure

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

the flat contacting surface is abutted against another side of the corresponding chip for transmitting heat energy there-between

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The at least one temperature conditioner has a fluid channel arranged inside thereof, a fluid entrance, and a fluid exit. The fluid entrance and the fluid exit are in spatial communication with the fluid channel.

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11022643B2Testing apparatus
Publication Date: 2021.06.01 ONE TEST SYST
  • US11022643B2 patent drawing
  • US11022643B2 patent drawing
  • US11022643B2 patent drawing

AI summary

A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units disposed on the circuit board. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure partially arranged in the accommodating slot. A portion of the lift structure having a chip receiving slot passes through an opening of the main body. The pressing device includes a temperature conditioner being controllable to increase or decrease temperature. When the lift structure is pressed by a flat structure of the temperature conditioner, the probe assemblies are connected to one side of a chip received in the chip receiving slot, and the flat contacting surface is abutted against another side of the chip for transmitting heat energy there-between.