Testing Apparatus Stiffener Isolates Probe Card from PCB Thermal Deformation
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Solution Overview
Problem
Existing testing systems for semiconductor devices face errors in electrical testing due to temperature-induced deformation of printed circuit boards, which affects probe connection accuracy and leads to distorted test results.
Innovation Solution
A testing apparatus design featuring a base that bears a first printed circuit board, with a stiffener and a second printed circuit board positioned to allow the probe card to pass through, reducing direct temperature exposure and minimizing deformation, thus maintaining probe connection accuracy across varying temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the PCB is directly connected to the probe card to bear the probe, then the probe connection is simple and direct, but the temperature variation causes PCB deformation and probe displacement leading to test errors
Solution Approach 1:
The patent introduces a support plate as an intermediary component between the probe card and the PCB. The support plate bears the probe and provides a stable mounting surface, while the PCB is mounted on the support plate rather than being directly connected to the probe card. This intermediary structure isolates the probe connection from temperature-induced PCB deformation, maintaining probe connection accuracy while preserving simplicity.
2Strength
If the PCB volume is increased to improve structural stability, then the PCB can better withstand mechanical loads, but the temperature-induced deformation increases causing probe displacement
Solution Approach 1:
The patent segments the support structure into separate components: a support plate and a PCB mounting plate. The support plate provides the primary structural stability and bears the probe, while the PCB mounting plate secures the PCB in place. This segmentation allows each component to be optimized independently - the support plate for structural strength and the mounting plate for precise PCB positioning - thereby maintaining probe connection accuracy while improving overall structural stability.
3Device complexity
If the probe card is directly exposed to the testing chamber environment, then the testing process is simple, but temperature variations cause PCB deformation and test result distortion
Solution Approach 1:
The support plate serves as a thermal intermediary, providing a stable mounting structure for the probe card while isolating it from direct exposure to temperature variations in the testing chamber. The support plate can be thermally managed separately, allowing the probe card to maintain a more stable temperature and preventing temperature-induced PCB deformation that would distort test results.
Data Source
AI summary
The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed adjacent to the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed adjacent to the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.