Testing Pins for Non-Destructive Shielding Conductivity Verification
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Solution Overview
Problem
The industry faces challenges in non-destructively testing the conductivity of electromagnetic shielding tapes to circuit board grounding areas, as current methods damage the circuit board and pose risks to circuit exposure, affecting performance.
Innovation Solution
An electronic device comprising a circuit board with a shielding member and testing pins, where the shielding layer is electrically connected to the testing pins, allowing for impedance testing using an open/short detection instrument without damaging the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the insulating layer is scraped off to measure impedance between the metal shielding layer and grounding area, then the conductivity measurement can be performed, but the appearance of the circuit board is damaged and circuits may be exposed
Solution Approach 1:
The patent applies preliminary action by pre-establishing electrical connection paths between the shielding layer and testing pins before the shielding member is installed. The testing pins are positioned to contact the shielding layer through the insulating layer, allowing conductivity testing without requiring subsequent destructive scraping of the insulating layer.
Solution Approach 2:
The patent introduces testing pins as intermediary elements that facilitate electrical connection between the shielding layer and the measurement instrument. These pins serve as mediators that allow impedance measurement without direct contact with the shielding layer, eliminating the need to scrape off the insulating layer and thus preventing circuit board damage.
2Reliability
If the insulating layer is scraped off to access the metal shielding layer, then conductivity testing is enabled, but the risk of circuit exposure and performance degradation increases
Solution Approach 1:
The electrical connection paths are established in advance during the manufacturing process, with testing pins positioned to make contact with the shielding layer through the insulating layer. This preliminary setup enables reliable conductivity verification without compromising circuit board integrity during subsequent testing operations.
Solution Approach 2:
Testing pins are introduced as intermediary components that provide a safe interface for electrical measurement. These pins allow conductivity testing to be performed reliably without requiring direct exposure of the metal shielding layer, thereby maintaining the protective insulating layer and preventing circuit board damage.
3Measurement precision
If conventional destructive testing is used to verify EMI tape conductivity, then measurement can be performed, but additional manufacturing steps and time are required
Solution Approach 1:
The testing pins are pre-positioned and electrically connected to the shielding layer during the assembly process, enabling immediate impedance measurement without requiring subsequent destructive scraping operations. This preliminary setup significantly reduces testing time and improves manufacturing efficiency.
Solution Approach 2:
The patent replaces the mechanical scraping process with an electrical measurement system. Instead of physically removing the insulating layer to access the shielding layer, the testing pins provide electrical access through the insulating layer, substituting a destructive mechanical operation with a non-contact electrical measurement approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables non-destructive testing of conductivity between the shielding member and the circuit board's grounding area, preventing damage and ensuring the integrity of the circuit board's appearance and performance.
Implementation Method 1
the shielding layer is electrically connected to the testing pin disposed on the circuit board... test the impedance via the testing pin to confirm the conductivity between the shielding member and the grounding area
Data Source
AI summary
An electronic device includes a circuit board, a shielding member, and a testing pin. The circuit board includes a grounding area. The shielding member is located on a side of the circuit board and includes a shielding layer and an insulating layer. The shielding layer is electrically connected to the grounding area. The insulating layer is located on a side of the shielding layer away from the circuit board. The testing pin is disposed on the circuit board and electrically connected to the shielding layer.