Tethered Closure Mold Layout for Below-Cap Hinges and Cooling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing mold components for tethered closure devices complicate the injection molding process due to the need for specialized components and poor cooling, which increases costs and reduces efficiency.

Innovation Solution

A mold arrangement using standard mold cores with improved heat-transfer properties, such as copper or copper alloys, allows for the formation of hinges below the cap body, eliminating the need for cut-outs and enabling efficient molding of tethered closures with membranous areas that deform upon opening, thus providing tamper evidence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If specialized mold components are used for injection molding of tethered closure devices, then the molding capability is improved, but the device complexity and manufacturing cost increase

Engineering Contradiction:

Improvemolding capabilityVSAvoidmold stack arrangement

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent inverts the conventional approach by positioning hinges below the cap body rather than above it. This inversion allows the cap to be molded as a single piece using standard mold components, eliminating the need for complex mold stack arrangements with multiple components and slides while maintaining the ability to form hinges and slits properly

Inventive Principle:

Principle #13The other way round (Inversion)

2Manufacturing precision

If specialized mold components are used for injection molding of tethered closure devices, then the molding capability is improved, but the heat transfer efficiency deteriorates

Engineering Contradiction:

Improvemolding capabilityVSAvoidcooling properties

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

By inverting the hinge position to below the cap body, the patent enables the use of standard mold cores with optimal cooling properties. The single-piece molding approach eliminates the need for specialized mold components that have poor cooling characteristics, allowing for efficient heat transfer during the injection molding process

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of manufacture

If cut-outs for slits are eliminated in the cap body, then the manufacturing process is simplified, but the opening mechanism effectiveness may be compromised

Engineering Contradiction:

Improvemolding processVSAvoidopening mechanism

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent eliminates cut-outs for slits by positioning hinges below the cap body and forming the cap as a single piece. The opening mechanism effectiveness is maintained through the leash and tongue engagement with the container neck, which provides reliable retention in the open position without requiring lateral slits in the cap body

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent moves the hinge mechanism from a lateral position (requiring slits) to a vertical position below the cap body. This dimensional change allows the cap to be molded as a single piece without lateral cut-outs, while the leash and tongue provide the necessary opening mechanism functionality through vertical engagement with the container neck

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables cost-effective and efficient manufacturing of tethered closures with improved tamper-evidence mechanisms, using standard mold components and enhancing cooling efficiency.

Implementation Method 1

copper or copper alloys for enhanced heat transfer

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS12629871B2Closure devices and mold components for molding closure devices

Publication Date: 2026.05.19 HUSKY INJECTION MOLDING SYST LTD

AI summary

A molding apparatus for molding a closure device for a container. The closure device may be tethered to the container, and may open and close via a hinged articulation. The closure device includes a cylindrical body comprising hinge-connecting areas with pockets formed in the interior wall and defining an inner surface of the hinge-connecting areas, and hinges extending downwardly from the hinge-connecting areas and positioned at or below a bottom edge of the cylindrical body. The molding apparatus comprises a cavity insert component and a core component that cooperate to form mold surfaces to mold the closure device such that hinges are located below the cap area of the closure device, and hinge-connecting areas formed by projections in the core mold component and recesses in the cavity mold component are located within the cap area are flanked by membranous areas.