Tetragonal Track Electronic Component Insulation
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Solution Overview
Problem
Multilayer electronic components experience a high probability of short-circuiting in specific locations due to inadequate insulation between coil conductor layers, leading to reliability issues.
Innovation Solution
The electronic component design incorporates a multilayer body with a tetragonal track configuration, where coil conductor layers are arranged to avoid direct contact at corners, ensuring adequate insulation with multiple insulator layers, thereby reducing the likelihood of short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If coil conductor layers are arranged to overlap in a compact multilayer configuration, then space utilization is improved, but the risk of short-circuit between adjacent conductor layers increases
Solution Approach 1:
The patent applies dimensionality change by ensuring conductor layers do not overlap at corner positions across different layers. Specifically, when viewed from the stacking direction, the fourth side of the tetragonal track in one layer does not overlap with the first side in adjacent layers, and the first corner is intentionally left without conductor layers. This spatial arrangement in three dimensions effectively increases insulation distance at critical points while maintaining compact overall structure.
Solution Approach 2:
The patent introduces insulator layers as intermediary elements between adjacent coil conductor layers. At least one insulator layer is positioned between the fourth side of one conductor layer and the first side of the next conductor layer in the stacking direction. This intermediary insulator layer acts as a protective barrier, preventing direct contact and reducing short-circuit risk between conductor layers that are in close proximity.
2Productivity
If conductor layers are positioned close together to form a compact coil structure, then manufacturing efficiency is improved, but insulation reliability deteriorates
Solution Approach 1:
The patent uses dimensionality change by creating a non-overlapping arrangement at corners across multiple layers. The first corner formed by the first side and fourth side is deliberately left without conductor layers in at least one layer, and the fourth side positioning ensures that conductor edges do not align vertically. This three-dimensional spatial arrangement maintains compact manufacturing while ensuring adequate insulation distance at the most vulnerable corner positions.
Solution Approach 2:
Insulator layers serve as intermediary protective elements positioned between adjacent coil conductor layers. The patent specifies that insulator layers are arranged between the fourth side of one conductor layer and the first side of the next conductor layer in the stacking direction, providing a reliable insulation barrier that maintains insulation reliability even when conductor layers are positioned close together for compact manufacturing.
Data Source
AI summary
An electronic component including, a first side, a second side, a third side, and a fourth side connected in that order in a predetermined direction so as to demarcate a tetragonal track. A first coil conductor layer lies astride the first side and the second side. A second coil conductor layer lies astride the second side and the third side and is connected to the first coil conductor layer on the second side. A third coil conductor layer lies astride the third side and the fourth side and is connected to the second coil conductor layer on the third side. At least one of the first coil conductor layer and the third coil conductor layer is not disposed at a first corner formed by the first side and the fourth side, when viewed from the stacking direction.