Textile Display with Conductive Stitching for High Pixel Density
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Solution Overview
Problem
Existing display technologies fail to achieve a high density of image points on textile supports, limiting their application in smart textiles, safety clothing, and automotive interior design due to the size and spacing constraints of optoelectronic semiconductor components.
Innovation Solution
The integration of RGB LEDs and control units into sequins, which are stitched onto a flexible textile support using electrically conductive contact threads, allowing for a high density of image points by adapting embroidery techniques to mount components closely and efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If optoelectronic semiconductor components are mounted on textile supports using conventional methods, then the components can be electrically connected, but the density of image points remains low due to size and spacing constraints
Solution Approach 1:
The patent segments the semiconductor components into modular sequins, each containing multiple LED chips arranged in a compact configuration. This segmentation allows the components to be densely packed on textile substrates while maintaining electrical connectivity through the stitching structure.
Solution Approach 2:
The patent implements nesting by integrating multiple functional elements within the sequin structure - LED chips, control units, and electrical connections are nested within the same component housing, reducing overall spacing requirements and enabling higher density mounting.
2Quantity of substance
If semiconductor components are made smaller to increase density, then pixel density improves, but manufacturing precision and electrical connection reliability become more difficult to achieve
Solution Approach 1:
The patent merges mechanical attachment and electrical connection functions into a single stitching operation. The conductive threads serve dual purposes: mechanically securing the sequins to the textile substrate while simultaneously providing electrical pathways to the LED chips and control units.
Solution Approach 2:
The stitching structure is designed to perform multiple functions simultaneously: mechanical fastening, electrical connection, and structural support. This multi-functionality reduces the need for separate connection elements, simplifying the manufacturing process while maintaining precision.
3Adaptability or versatility
If conventional mounting methods are used, then the production process is simple, but the flexibility and durability of the display device on textile substrates is limited
Solution Approach 1:
The patent replaces conventional mechanical mounting methods (adhesives, clips, or rigid fasteners) with a stitching-based system that integrates the semiconductor components into the textile fabric structure. This substitution provides mechanical flexibility while maintaining electrical connectivity.
Solution Approach 2:
The sequins are designed with flexible housings that can conform to the textile substrate, allowing the display device to bend and flex with the fabric. This flexibility is maintained while ensuring reliable electrical connections through the stitching structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of display devices with a high pixel density, enabling variable patterns, signals, and images, and offers flexibility and durability suitable for smart textiles, safety clothing, and automotive applications.
Implementation Method 1
The electrical connections or at least part of the electrical connections of the semiconductor components or of part of the semiconductor components are electrically established via electrically conductive contact threads
Implementation Method 2
The semiconductor components are in particular light-emitting diodes, LEDs for short. The semiconductor components can be configured as RGB LEDs. Red, green and blue light can preferably be generated independently of one another in the semiconductor components.
Implementation Method 3
The semiconductor components are stitched onto the support. This means that a connection between the semiconductor components and the support is effected via at least one thread which is pulled through the respective semiconductor component and the support.
Data Source
AI summary
A display device and a method for producing a display device are disclosed. In an embodiment a display device includes a flat textile support and a plurality of optoelectronic semiconductor components disposed on the support. Each semiconductor component includes a connection substrate comprising a plurality of electrical connections, the plurality of electrical connections electrically connected via electrically conductive contact threads, wherein each electrical connection is realized by a contact hole which completely penetrates through the semiconductor component and, viewed in a plan view, is surrounded all around by the connection substrate and wherein, in each case, at least one contact thread runs through the contact hole so that the contact thread is arranged in part on an upper side of the semiconductor component facing away from the support, a plurality of semiconductor chips for generating light and at least one control unit for adjusting a color location of the light.