Textile-Reinforced Semiconductor Packaging for Thin Die Stacks
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Solution Overview
Problem
Conventional semiconductor device packaging is weakened by minimizing the thickness of the encapsulant and substrate during die stacking, leading to structural vulnerability and increased risk of premature failure due to external forces during handling and use.
Innovation Solution
Incorporating a textile reinforcing layer within the encapsulant, which is embedded with synthetic or natural fibers, to enhance the mechanical strength and flexibility of the semiconductor device package, allowing it to withstand greater external forces without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If die stacking is maximized within an individual package, then the capacity or performance of the microelectronic device is increased, but the protective covering thickness is reduced and the package structurally weakens
Solution Approach 1:
The patent applies composite materials by embedding a textile reinforcing layer (comprising fibers such as glass, aramid, or carbon) within the encapsulant material. This creates a composite structure where the encapsulant provides protection and the textile layer provides structural reinforcement, allowing the package to maintain strength even when the encapsulant thickness is reduced due to maximized die stacking.
2Volume of moving object
If the protective covering thickness is reduced, then the package size is minimized, but the package becomes vulnerable to external forces and sustains damage
Solution Approach 1:
The textile reinforcing layer embedded in the encapsulant creates a composite material structure that provides high strength-to-thickness ratio. This allows the package to maintain reliability and resistance to external forces while keeping the overall package size minimized, as the reinforcement is integrated within the encapsulant rather than adding external thickness.
Solution Approach 2:
The patent uses a thin textile reinforcing layer (e.g., 0.001 to 0.01 inches thick) embedded within the encapsulant to provide structural support. This thin reinforcement layer acts as a flexible yet strong element that prevents package failure from external forces without significantly increasing package size.
3Volume of moving object
If the substrate thickness is minimized, then the package size is reduced, but the package strength is further reduced
Solution Approach 1:
The textile reinforcing layer embedded in the encapsulant compensates for the reduced substrate thickness. The composite structure of encapsulant plus textile reinforcement provides the necessary structural support that would otherwise be provided by a thicker substrate, allowing minimal substrate thickness while maintaining package strength.
Data Source
AI summary
The subject application relates to reinforced semiconductor device packaging and associated systems and methods. The device generally includes a substrate and one or more integrated circuit dies electrically coupled to the substrate with wire bonds. The device includes an encapsulant enclosing the one or more dies and the wire bonds. The package can include a reinforcing layer positioned on one or more surfaces of the encapsulant, a reinforcing wire extending through the encapsulant, or entrained reinforcing fiber portions positioned throughout the encapsulant. The reinforcing layer can be textile woven from synthetic or natural fibers, such as aramid, carbon, or glass. The package can be formed by disposing a reinforcing textile layer in a mold, placing a die and substrate in the mold with a liquid encapsulant, and hardening the liquid encapsulant to adhere the reinforcing textile layer, the encapsulant, the die, and the substrate together.