Textured Carrier for Microelectronic Assemblies
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Solution Overview
Problem
Conventional carrier methods for microelectronic components in IC device manufacturing are inadequate for precise and high-throughput processing, particularly for direct bonding, due to issues with particle generation, cleanliness, and handling of ultra-thin dies, leading to yield defects and reduced productivity.
Innovation Solution
A textured carrier assembly with texturized microstructures and an electrostatic carrier system that uses high permittivity dielectric materials and actuatable materials to enable precise mechanical and electrostatic coupling of microelectronic components, allowing for direct bonding and improved handling of ultra-thin dies without particle generation or electrical static events.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vacuum nozzle-based carrier systems are used for transferring and placing dies, then the manufacturing process can be implemented with existing technology, but particle generation occurs and cleanliness is compromised leading to yield defects
Solution Approach 1:
The patent replaces the conventional vacuum nozzle-based mechanical carrier system with a textured carrier system that uses controlled adhesion through microstructures. The textured surface with microstructures enables die attachment through contact with the microstructure tips rather than vacuum suction, eliminating particle generation associated with vacuum nozzle operation and die handling.
Solution Approach 2:
The patent changes the surface parameters of the carrier by introducing texturized microstructures with specific geometric characteristics (tip radius, height, spacing). These parameter changes enable controlled adhesion forces that allow precise die placement and release without the harmful effects of conventional vacuum systems, improving cleanliness and yield.
2Manufacturing precision
If conventional carrier methods are used for handling ultra-thin dies, then the process can proceed with standard equipment, but handling precision is insufficient leading to positioning errors and yield defects
Solution Approach 1:
The patent applies local quality by creating localized adhesion zones through the textured microstructures on the carrier surface. Each microstructure provides a localized contact point for die attachment, enabling precise positioning and controlled release. The non-uniform distribution of microstructures allows selective adhesion and release of individual dies with high precision.
Solution Approach 2:
The carrier surface is segmented into numerous discrete microstructures rather than using a uniform vacuum field. This segmentation allows independent control of adhesion at each microstructure location, enabling precise handling and placement of ultra-thin dies without the limitations of conventional vacuum nozzle systems.
3Productivity
If conventional vacuum nozzle systems are used for die transfer and placement, then the system can operate with simple mechanics, but throughput is limited and productivity is reduced
Solution Approach 1:
The patent transitions from a two-dimensional vacuum field to a three-dimensional textured surface with vertical microstructures. This dimensional change enables multiple dies to be handled simultaneously across the carrier surface with independent adhesion control, significantly increasing throughput while the microstructure geometry provides the necessary complexity for precise handling.
Solution Approach 2:
The textured microstructures are pre-formed on the carrier surface before die attachment. This preliminary structuring of the carrier surface enables rapid die pick-up and placement operations without requiring complex real-time control mechanisms, improving throughput while maintaining manageable system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances precision and cleanliness in microelectronic component placement, achieving higher throughput and reducing yield defects by enabling precise and clean handling of ultra-thin dies through mechanical and electrostatic coupling, while maintaining the integrity of the components during processing.
Implementation Method 1
an electrostatic carrier system that uses high permittivity dielectric materials
Implementation Method 2
high permittivity dielectric materials
Implementation Method 3
textured carrier assembly with texturized microstructures to enable precise mechanical and electrostatic coupling
Data Source
Figure 1A~1D
Figure 2A~3E
Figure 4A~5B
AI summary
Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.