Textured Chamber Surface with Rounded Corners
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Solution Overview
Problem
Existing substrate processing chamber components face contamination issues due to process residues adhering to and flaking off from textured surfaces, leading to substrate contamination and surface stress, erosion, and cracking, particularly with sharp edges and corners that accumulate deposits and cause fractures.
Innovation Solution
A method of fabricating components with textured surfaces featuring raised features and depressions, where the top corners are rounded to reduce stress and erosion, achieved through etching with a patterned mask and subsequent grit blasting or electrochemical graining to smooth edges and corners, and material deposition via a patterned mask to form smooth, curved features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If sharp-angled raised surfaces are formed to trap process deposits, then substrate contamination is reduced, but surface stress and cracking increase
Solution Approach 1:
The patent applies curvature by rounding the top corners of raised features instead of leaving them sharp-angled. This is achieved through controlled etching processes that create curved transition zones at the corners, reducing stress concentration while maintaining the deposit-trapping functionality of the raised surfaces. The curved geometry distributes mechanical stress more evenly, preventing cracking while preserving the ability to secure process deposits.
2Object-affected harmful factors
If electromagnetic energy beam is used to create textured surface, then substrate contamination is reduced, but manufacturing cost and complexity increase
Solution Approach 1:
The patent replaces complex electromagnetic energy beam systems with simpler mechanical or chemical etching methods. The texturing is achieved through photoresist masking followed by conventional etching processes, which are more straightforward and cost-effective while achieving the same functional outcome of creating deposit-trapping textured surfaces that prevent substrate contamination.
Solution Approach 2:
The patent uses disposable photoresist masks that are applied, patterned, and then removed after transferring the pattern to the component surface. This approach is more economical than investing in expensive, complex electromagnetic beam equipment, as the photoresist masks are low-cost consumables that enable simple texturing processes.
3Ease of manufacture
If photoresist mask etching is used to form raised surfaces, then manufacturing cost is reduced, but surface erosion and cracking increase
Solution Approach 1:
The patent modifies the standard photoresist etching process to create curved corner geometries in the raised features. By controlling the etching parameters and mask design, rounded corners are formed that eliminate stress concentration points, thereby preventing cracking and erosion while maintaining the simplicity and cost-effectiveness of the photoresist masking approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces substrate contamination by ensuring process residues adhere to the component surfaces, minimizing stress and erosion, and maintaining the integrity of the textured surface, thereby preventing cracking and flaking.
Implementation Method 1
grit particles are propelled at the top corners of the raised features with a pressurized gas to erode material from the top corners
Implementation Method 2
the raised features are electrochemically grained to erode material from the top corners
Implementation Method 3
A material is sprayed through the apertures and onto the surface to form a textured surface having raised features comprising the material
Data Source
AI summary
A method of fabricating a process chamber component having a textured surface includes applying a resist layer on an underlying surface of the component. A predetermined pattern of apertures is formed in the resist layer that exposes the underlying surface of the component. The underlying surface is etched through the apertures in the resist layer to form a textured surface having raised features with top corners. The resist layer is removed, and a treatment step is performed to form top corners that are rounded. In another method, the textured surface is formed by providing a patterned mask having apertures above the surface of the component. A material is sprayed through the apertures in the patterned mask and onto the surface to form a textured surface with raised features having the material.