Textured Electrostatic Carrier for Clean Direct Die Bonding
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Solution Overview
Problem
Conventional carrier methods for microelectronic components in IC device manufacturing are inadequate for precise and high-throughput processing, particularly for direct bonding, due to issues with particle generation, cleanliness, and handling of small dies, leading to yield defects and reduced productivity.
Innovation Solution
A textured carrier assembly with texturized microstructures and an electrostatic carrier system that uses high permittivity dielectric materials and electrodes to electrostatically couple microelectronic components, enabling precise placement and handling without particle generation, and allowing for direct bonding and collective or individual assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional vacuum nozzle-based carrier systems are used for transferring and placing dies, then the handling process is simple, but particle generation occurs and cleanliness is compromised leading to yield defects
Solution Approach 1:
The patent replaces the conventional mechanical vacuum nozzle-based handling system with an electrostatic field-based system. The electrostatic carrier uses electrostatic fields to hold, transfer, and place microelectronic components, eliminating the mechanical contact that generates particles. This substitution maintains high throughput while significantly reducing particle generation and improving cleanliness.
Solution Approach 2:
The patent introduces an electrostatic field as an intermediary between the carrier and the microelectronic components. The electrostatic field acts as a non-contact mediator that enables precise handling and placement of dies without mechanical contact, thereby preventing particle generation while maintaining efficient throughput.
2Manufacturing precision
If conventional carrier methods are used, then the handling process is straightforward, but precision in placement is insufficient for direct bonding applications
Solution Approach 1:
The patent replaces simple mechanical vacuum nozzle systems with a more complex but precise electrostatic field-based carrier system. The electrostatic carrier incorporates electrodes and control circuitry that enable precise positioning and placement of microelectronic components, achieving the required manufacturing precision for direct bonding applications.
Solution Approach 2:
The patent utilizes changes in electrostatic field parameters (voltage, field distribution) to control the position and placement of microelectronic components. By dynamically adjusting electrostatic field parameters, the system achieves high precision placement while managing the inherent complexity of the electrostatic carrier system.
3Reliability
If conventional handling methods are used for small dies, then the process is simple, but yield defects increase due to poor handling capability
Solution Approach 1:
The patent replaces conventional mechanical handling methods with an electrostatic field-based system that provides superior control over small dies. The electrostatic carrier system's ability to hold and manipulate components through non-contact electrostatic forces significantly improves handling reliability and reduces yield defects, justifying the increased system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances precision and cleanliness in microelectronic component handling and assembly, achieving higher throughput and reducing yield defects by minimizing particle generation and improving handling of small dies through electrostatic coupling and texturized microstructures.
Implementation Method 1
an electrostatic carrier system that uses high permittivity dielectric materials and electrodes to electrostatically couple microelectronic components
Implementation Method 2
uses high permittivity dielectric materials and electrodes to electrostatically couple microelectronic components
Implementation Method 3
A textured carrier assembly with texturized microstructures and an electrostatic carrier system that uses high permittivity dielectric materials and electrodes to electrostatically couple microelectronic components
Data Source
AI summary
Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.