Textured Solder Preform Surface for Low-Void Solder Joints
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Solution Overview
Problem
High void rates in solder joints due to trapped gases during the soldering process, leading to increased thermal resistance, reduced reliability, and potential cracking or fracture of electronic components.
Innovation Solution
A solder preform with protruding and/or recessing portions on its surface, allowing for gas escape channels, which reduces the void rate and improves soldering quality by facilitating gas discharge during preheating and soldering stages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planar solder preform is used for packaging and soldering, then the soldering process can be completed, but the gas generated during soldering is trapped in the soldering surface because there is no escape path, resulting in high soldering void rate and poor soldering quality
Solution Approach 1:
The planar solder preform surface is segmented into multiple protruding portions and recessing portions. The recessing portions create gas escape channels that allow gas to escape during soldering, preventing gas trapping and reducing void rate while maintaining soldering quality
Solution Approach 2:
The solder preform surface is designed with a porous-like structure consisting of protruding portions and recessing portions. This structure provides multiple gas escape paths similar to porous materials, enabling gas to escape during the soldering process without compromising the integrity of the solder joint
2Ease of manufacture
If the solder preform surface is made completely flat, then the manufacturing process is simple, but the gas generated during preheating and soldering stages cannot escape, leading to increased void rate
Solution Approach 1:
Instead of creating a completely complex three-dimensional structure, the surface is segmented into simple protruding portions and recessing portions that can be easily manufactured. This segmentation provides gas escape paths while maintaining relatively simple manufacturing processes
Solution Approach 2:
The surface parameters of the solder preform are changed by introducing protruding portions and recessing portions with specific dimensions and distributions. These parameter changes create gas escape channels without requiring complex manufacturing processes, balancing ease of manufacture with void rate control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the void rate and enhances soldering quality by ensuring gas escape, thereby improving the reliability and thermal performance of solder joints.
Implementation Method 1
the protruding portions and/or recessing portions of the interval prevent the solder preform from completely closing the surface of the material to be soldered at the same time, so that the gas generated in the preheating stage and the soldering stage is discharged with sufficient time and channels
Data Source
AI summary
A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.