Textured Semiconductor Substrate for Passive Thermal Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods for semiconductor devices, such as using heat sinks, require additional materials and interfaces that increase thermal resistance and cost, and are not suitable for space-constrained applications like handheld devices where forced convection is not practical.
Innovation Solution
A semiconductor device with a textured back surface to enhance thermal transfer, eliminating the need for die attach or thermal interface materials, and integrating a monolithic heat sink on the silicon substrate to improve conduction, convection, and radiation heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks with die attach materials are used, then heat dissipation is achieved, but thermal resistance increases and cost increases
Solution Approach 1:
The patent merges the substrate and heat sink into a single monolithic structure, eliminating the need for separate die attach materials and interfaces. The substrate itself is designed with integrated heat dissipation features, combining the mechanical support function and thermal management function into one component, thereby reducing thermal resistance at interfaces.
Solution Approach 2:
The patent extracts and eliminates the die attach materials and intermediate thermal interface materials from the thermal path. By removing these additional layers and interfaces, the thermal resistance is reduced, allowing more efficient heat transfer from the device to the heat sink.
2Temperature
If conventional heat sinks are used, then heat dissipation is achieved, but device complexity and cost increase
Solution Approach 1:
The substrate and heat sink are merged into a single monolithic structure, reducing the number of discrete components and assembly steps. This integration simplifies the overall device structure and reduces complexity in both manufacturing and system integration.
3Temperature
If forced convection cooling is used, then heat dissipation is improved, but space constraints in handheld devices are violated
Solution Approach 1:
The heat sink is designed to utilize natural convection and radiation for heat dissipation without requiring external forced convection systems like fans. The monolithic structure with integrated heat dissipation features enables the device to cool itself passively, eliminating the need for additional active cooling components that would increase device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides efficient heat dissipation without additional cost or performance degradation, optimizing thermal performance in space-constrained environments by increasing the surface area for heat transfer through the substrate, enhancing both convection and radiation heat transfer.
Implementation Method 1
enhance thermal transfer between the substrate and an external environment
Implementation Method 2
enhance thermal transfer between the substrate and an external environment
Implementation Method 3
Heat transfer involves the movement of heat from one point to another point due to a difference in temperature between the two points. Some of the primary mechanisms by which heat can be transferred from one region to another include conduction
Data Source
AI summary
A semiconductor device having enhanced thermal transfer includes at least one die, including a device layer in which one or more functional circuit elements are formed and a substrate supporting the device layer, and a support structure. The die is disposed on the support structure using at least one connection structure coupled between the device layer and the support structure. A back surface of the substrate is textured so as to increase a surface area of the back surface to thereby enhance thermal transfer between the substrate and an external environment.