Textured Transparent Conductive Oxide Electrodes for Light Trapping

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Solution Overview

Problem

Current methods for forming textured transparent conductive oxide (TCO) films in photovoltaic and display applications are hindered by the need for high-temperature chemical vapor deposition, use of toxic gases, and difficulties in scaling up processes, which lead to high costs, environmental concerns, and limitations in substrate materials and light transmission.

Innovation Solution

A bi-layer transparent semiconducting film structure is created using a two-step sputtering process with metal oxides having different crystalline temperatures, eliminating the need for wet-etching and CVD processes, and utilizing In2O3 and ZnO/SnO2-based materials doped with specific dopants to achieve surface texturing without expensive toxic gases or environmental hazards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If chemical vapor deposition (CVD) is used to form textured TCO films, then light trapping and device efficiency are improved, but processing temperature increases and toxic gases are required

Engineering Contradiction:
Improvedevice efficiencyVSAvoidprocessing temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The invention changes the deposition method from CVD to sputtering, which operates at lower temperatures. The sputtering process uses physical bombardment rather than chemical reactions, eliminating the need for high temperatures and toxic gases while still achieving textured TCO films with good light trapping properties

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention replaces the chemical CVD process with a physical sputtering process. Instead of using chemical vapor deposition and high-temperature reactions, the sputtering method uses ion bombardment to deposit TCO materials, substituting chemical mechanisms with physical mechanisms to achieve the same textured film formation at lower temperatures

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If wet-etching is used to create surface texture on TCO films, then light scattering is improved, but additional chemicals and process complexity are introduced

Engineering Contradiction:
Improvelight scatteringVSAvoidprocess complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The invention combines the film deposition and surface texturing steps into a single sputtering process. By adjusting sputtering parameters such as power, pressure, and substrate temperature, the process simultaneously deposits the TCO layer and creates the desired surface texture, eliminating the need for separate wet-etching steps and reducing overall process complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sputtering process itself generates the surface texture through self-organization mechanisms during deposition. The physical bombardment and material accumulation naturally create textured surfaces with good light scattering properties, making the process self-sufficient without requiring additional chemical etching steps

Inventive Principle:
Principle #25Self-service

3Reliability

If high-temperature CVD processes are used, then TCO film quality is improved, but substrate material choices are limited and production costs increase

Engineering Contradiction:
ImproveTCO film qualityVSAvoidsubstrate material choices
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The invention changes the deposition temperature parameter from high-temperature CVD to lower-temperature sputtering. This parameter change enables the use of temperature-sensitive substrates such as plastics and flexible substrates that cannot withstand high temperatures, while still producing high-quality TCO films with good electrical conductivity and optical properties through optimized sputtering conditions

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in lower processing temperatures, reduced material usage, improved near-infrared transmission, and enhanced light scattering effects, making the process more environmentally friendly, cost-effective, and suitable for large-scale production while maintaining high electrical conductivity and optical transparency.

Implementation Method 1

A bi-layer transparent semiconducting film structure is created using a two-step sputtering process with metal oxides having different crystalline temperatures

Methodology Applied
Scientific EffectSputtering: Sputtering

Implementation Method 2

metal oxides having different crystalline temperatures, for example, one of the metal oxides has a first crystalline temperature while the other of the metal oxides has a second crystalline temperature of about 50° C. lower or higher than the first crystalline temperature

Methodology Applied
Scientific EffectCrystallisation: Crystallisation

Data Source

PatentUS10103282B2Direct texture transparent conductive oxide served as electrode or intermediate layer for photovoltaic and display applications
Publication Date: 2018.10.16 HONG KONG APPLIED SCI & TECH RES INST
  • US10103282B2 patent drawing
  • US10103282B2 patent drawing
  • US10103282B2 patent drawing

AI summary

The present invention provides transparent semiconducting films for constructing a translucent electrode that possess a high transparency and low sheet resistance. Further, the transparent semiconducting films have a high light diffusion property, which is capable to be a translucent front/back electrode in a light-emitting device for improving the light emission efficiency and a front/intermediate/back electrode in a multi-junction solar cell for improving the light trapping effect. Related fabrication method and how they are applied in different fields are also provided in the present invention.