TFE/HFP Copolymer Melt Flow Control for Wire Lumping

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Solution Overview

Problem

Conventional techniques fail to adequately prevent the formation of large lumps during the production of electric wires coated with tetrafluoroethylene/hexafluoropropylene (TFE/HFP) copolymers, which hampers productivity and increases defects in molding processes.

Innovation Solution

A TFE/HFP copolymer with a specific melt flow rate, swell percentage, and reduced number of end groups is developed, which minimizes the likelihood of lump formation or reduces the size of lumps if they form, by controlling the melt flow rate between 35.0-45.0 g/10 min, swell between -8.0% to 5.0%, and limiting end groups to ≤120 per 10^6 carbon atoms, thereby enhancing moldability and reducing defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional TFE/HFP copolymers are used for electric wire coating, then insulation properties are maintained, but lump formation occurs during molding reducing productivity

Engineering Contradiction:
Improvemolding speedVSAvoidlump formation
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by precisely controlling the melt flow rate (35.0-45.0 g/10 min at 372°C) and swell ratio (-8.0% to 5.0%) of the TFE/HFP copolymer. These parameter optimizations enable high-speed extrusion molding while preventing lump formation, directly resolving the contradiction between productivity and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If high molding speed is achieved, then productivity increases, but defect formation increases

Engineering Contradiction:
Improvemolding speedVSAvoiddefect rate
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent optimizes processing parameters by controlling the melt flow rate within 35.0-45.0 g/10 min and swell ratio within -8.0% to 5.0%, enabling high-speed molding at 100 m/min or higher while maintaining low defect rates. This resolves the contradiction between productivity and reliability.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If copolymer composition is adjusted for better formability, then molding performance improves, but insulation properties may deteriorate

Engineering Contradiction:
ImproveformabilityVSAvoidinsulation properties
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent achieves both good formability and insulation properties by optimizing the HFP content (5-20 mass%) and controlling melt flow rate (35.0-45.0 g/10 min) and swell ratio (-8.0% to 5.0%). This balanced parameter optimization resolves the contradiction between ease of manufacture and reliability.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP3091042B1Tetrafluoroethylene/hexafluoropropylene copolymer, and electric wire
Publication Date: 2021.10.20 DAIKIN INDUSTRIES LTD
  • EP3091042B1 patent drawing
  • EP3091042B1 patent drawing
  • EP3091042B1 patent drawing

AI summary

Provided is a tetrafluoroethylene/hexafluoropropylene copolymer which is less likely to form a lump, or is less likely to form a large lump even if a lump is formed, during the formation of an electric wire. The tetrafluoroethylene/hexafluoropropylene copolymer has a melt flow rate measured at 372°C of 35.0 to 45.0 g/10 minutes and a swell of -8.0% to 5.0%, the sum of the numbers of -CF2H groups and unstable end groups being 120 or less per 1 × 106 carbon atoms.