Thin Film Magnet 3D Inductor for High Q-Factor RF
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Solution Overview
Problem
The design of mobile RF transceivers faces challenges in achieving high-quality (Q)-factor radio frequency performance due to increased complexity and constraints in deep sub-micron process nodes, particularly in maintaining small feature sizes and reducing magnetic loss at high frequencies, which is exacerbated by the use of conventional inductor designs.
Innovation Solution
A thin film magnet (TFM) three-dimensional inductor structure is fabricated by depositing a magnetic thin film layer on the substrate and conductive vias, with conductive traces directly on the magnetic layer, enhancing inductance and Q-factor while minimizing magnetic loss by eliminating eddy currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional inductor designs are used in deep sub-micron process nodes, then manufacturing complexity is reduced, but magnetic loss increases and Q-factor decreases at high frequencies
Solution Approach 1:
The patent transitions from planar 2D inductor designs to three-dimensional 3D inductor structures by depositing magnetic thin film layers on vertical sidewalls of conductive vias. This vertical dimensionality addition increases inductance density and Q-factor while reducing magnetic loss at high frequencies, directly resolving the contradiction between energy loss and structural complexity.
Solution Approach 2:
The patent employs composite material structures combining conductive materials (copper, aluminum) with magnetic thin film materials (ferrite, nickel-zinc-ferrite, cobalt-ferrite) deposited on conductive vias and substrates. This composite approach enhances inductance and Q-factor while minimizing magnetic loss, addressing the contradiction between energy efficiency and structural complexity.
2Length of moving object
If feature size is reduced to maintain small dimensions, then device integration is improved, but magnetic loss increases due to eddy currents
Solution Approach 1:
The patent uses thin film magnetic layers (50-500 nanometers thick) deposited on conductive vias and substrates. These thin films provide magnetic functionality while minimizing eddy current losses that plague conventional bulk magnetic materials at high frequencies, thereby reducing magnetic loss while maintaining small feature sizes.
Solution Approach 2:
The patent applies magnetic thin film coatings selectively to specific locations - on the sidewalls of conductive vias and on the substrate surface - rather than using bulk magnetic materials throughout. This localized application provides magnetic enhancement where needed while minimizing overall magnetic loss, resolving the contradiction between small feature size and energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TFM 3D inductor structure significantly improves inductance and Q-factor, reducing magnetic loss at high frequencies, thus addressing the design challenges of mobile RF transceivers by using thin film magnets directly on the substrate.
Implementation Method 1
a magnetic thin film layer on at least sidewalls of the conductive vias and on a first side and an opposing second side of the substrate
Implementation Method 2
conductive vias extending through the substrate... a first conductive trace directly on the magnetic thin film layer... electrically coupling to at least one of the conductive vias
Data Source
AI summary
A thin film magnet (TFM) three-dimensional (3D) inductor structure may include a substrate with conductive vias extending through the substrate. The TFM 3D inductor structure may also include a magnetic thin film layer on at least sidewalls of the conductive vias and on a first side and an opposing second side of the substrate. The TFM 3D inductor structure may further include a first conductive trace directly on the magnetic thin film layer on the first side of the substrate and electrically coupling to at least one of the conductive vias. The TFM 3D inductor structure also includes a second conductive trace directly on the magnetic thin film layer on the second side of the substrate and coupled to at least one of the conductive vias.