Thin Film Transistor Array Substrate Fabrication via Dip Strip
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Solution Overview
Problem
The manufacturing process of thin film transistor array substrates for liquid crystal display devices is complex and costly due to the need for multiple mask processes, which limits the reduction of manufacturing costs and complexity.
Innovation Solution
A method and apparatus that utilize a dip strip component, a brushing component, and jet strip components to remove photo-resist patterns and residual thin films using a stripper, reducing the number of mask processes required from four to three, thereby simplifying the fabrication process and lowering costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple mask processes are used to fabricate thin film transistor array substrates, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates unnecessary mask processes from the fabrication sequence. By carefully designing the photoresist pattern formation and development process, it achieves the required pattern precision with fewer mask steps, directly reducing process complexity while maintaining manufacturing precision
Solution Approach 2:
The patent makes the photoresist pattern serve multiple functions simultaneously. The same photoresist pattern is used for defining multiple device features across different fabrication stages, allowing a single mask process to achieve what would traditionally require multiple separate mask steps
2Manufacturing precision
If multiple mask processes are used to fabricate thin film transistor array substrates, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent merges multiple mask processes into a reduced number of combined steps. By integrating pattern definition and feature formation into fewer unified mask operations, it simultaneously achieves precise patterning and reduces the total fabrication cycle time
Solution Approach 2:
The patent performs preliminary photoresist pattern formation that anticipates future fabrication needs. The photoresist is patterned in advance to define multiple features that will be used throughout subsequent processing steps, eliminating the need for repeated mask applications
3Ease of manufacture
If photo-resist patterns and residual thin films are not efficiently removed, then ease of manufacture is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent replaces complex mechanical or chemical removal systems with a simplified dip-strip method. By using a liquid stripper solution that chemically dissolves photoresist and residual films, it achieves clean pattern definition without requiring complex removal equipment or multiple processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach significantly reduces the time and cost of fabricating thin film transistor array substrates by simplifying the manufacturing process, improving productivity, and minimizing defects through efficient removal of photo-resist patterns and residual thin films.
Implementation Method 1
dipping a substrate in a first stripper, wherein the substrate has a photo-resist pattern and a thin film, the thin film being formed on an entire surface of the substrate so as to cover the photo-resist pattern
Implementation Method 2
a brushing component, configured to remove a residual photo-resist pattern
Implementation Method 3
a first jet strip component configured to remove residual photo-resist particles on the substrate
Data Source
AI summary
The present invention relates to an apparatus and a method of fabricating a thin film transistor array substrate. The apparatus includes a dip strip component for stripping a photo-resist pattern and a thin film formed on a substrate by using a stripper; a removing part for removing residual photo-resist and thin film from the substrate; and a jet strip component for jetting the stripper to remove residual particles of photo-resist and thin film left on the substrate. The method of fabricating includes dipping a substrate in a stripper, wherein the substrate has a photo-resist pattern and a thin film, the thin film being formed on an entire surface of the substrate so as to cover the photo-resist pattern; removing residual photo-resist and thin film using the stripper; and removing particles of residual photo-resist and thin film left on the substrate.