TFT Array Substrate 3-Mask Process Merging Pixel and Data Lines

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Solution Overview

Problem

The conventional 4-Mask process for manufacturing TFT array substrates is complex, costly, and time-consuming, limiting the efficiency and yield of thin film transistor liquid crystal displays.

Innovation Solution

A 3-Mask process is employed, involving specific layer deposition and photolithography steps to form common electrode lines, gate electrodes, source and drain electrodes, via holes, and connections for data lines and pixel electrodes, reducing the number of processes and improving efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a 4-Mask process is used to manufacture TFT array substrate, then the manufacturing precision and reliability are maintained, but the device complexity and production time increase significantly

Engineering Contradiction:
Improvepattern formation precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the formation of pixel electrodes and data lines into a single photolithography step by depositing both materials simultaneously and patterning them together. This combines what were previously separate processing steps into one unified operation, reducing the total mask count from 4 to 3 while maintaining pattern precision through coordinated deposition and single-step patterning

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If a 4-Mask process is used to manufacture TFT array substrate, then the manufacturing precision is maintained, but the production cost increases

Engineering Contradiction:
Improvepattern formation precisionVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent reduces production cost by merging the pixel electrode and data line formation into a single photolithography step. This eliminates one mask alignment step and reduces the total number of photolithography processes from 4 to 3, directly lowering manufacturing costs while maintaining pattern precision through simultaneous deposition and unified patterning

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If a 4-Mask process is used to manufacture TFT array substrate, then the manufacturing precision is maintained, but the productivity decreases

Engineering Contradiction:
Improvepattern formation precisionVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent improves productivity by combining the formation of pixel electrodes and data lines into one photolithography step. This reduces the total number of photolithography processes from 4 to 3, shortening the production cycle and increasing throughput while maintaining pattern precision through coordinated deposition and single-step patterning of both structures

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The 3-Mask process decreases production costs and increases efficiency by simplifying the manufacturing process, reducing the complexity and duration of the TFT array substrate production.

Implementation Method 1

depositing a gate metal layer, a gate insulating layer, a semiconductor layer and a source-drain electrode layer

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

depositing a gate metal layer, a gate insulating layer, a semiconductor layer and a source-drain electrode layer

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

performing a first photolithograph process, and form common electrode lines, gate lines, a gate electrode, a source electrode, a drain electrode and a channel

Methodology Applied
Scientific EffectPhotolithography: Photography

Implementation Method 4

faun a first via hole in the passivation layer located above the source electrode and a second via hole in the passivation layer located above the drain electrode

Methodology Applied
Scientific EffectEtching:

Data Source

PatentUS9196683B2Thin film transistor array substrate and method for manufacturing the same
Publication Date: 2015.11.24 BOE TECHNOLOGY GROUP CO LTD
  • US9196683B2 patent drawing
  • US9196683B2 patent drawing
  • US9196683B2 patent drawing

AI summary

The present disclosure discloses a method for manufacturing a TFT array substrate, comprising: depositing a gate metal layer, a gate insulating layer, a semiconductor layer and a source-drain electrode layer in this order on a base substrate, performing a first photolithograph process to form a common electrode line, a gate line, a gate electrode, a source electrode, a drain electrode and a channel defined between the source electrode and the drain electrode; depositing a passivation layer, performing a second photolithograph process to form a first via hole and a second via hole in the passivation layer; and depositing a pixel electrode layer and a data line layer in this order, perform a third photolithograph process to form a data line connected to the source electrode through the first via hole and a pixel electrode connected to the drain electrode through the second via hole.