Thin Film Transistor Substrate Buffer Module for Wiring Protection
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Solution Overview
Problem
The existing thin film transistor substrates face a challenge in preventing damage to wiring assemblies during the manufacturing process of semi-finished liquid crystal display panels, as the thin protection layer is vulnerable to physical impact from surplus materials being removed along a cutting line, leading to a decreased yield rate.
Innovation Solution
A thin film transistor substrate with a buffer module positioned above the cutting line, comprising a conductive bottom layer and an insulating wrapping layer, which absorbs and redirects the physical impact from surplus materials, protecting the wiring assemblies and purging areas, and includes additional assistant buffers for enhanced protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the protection layer is made thin to reduce overall substrate thickness, then the substrate profile is improved and assembly is easier, but the wiring assemblies become vulnerable to damage from physical impact during manufacturing
Solution Approach 1:
A buffer module is positioned above the projection of the cutting line onto the base substrate, between the cutting line and the wiring assemblies. This buffer module absorbs and redirects the impact of surplus materials before they can reach the wiring assemblies, providing beforehand cushioning that protects the vulnerable thin protection layer and wiring assemblies during the surplus material removal process
Solution Approach 2:
The buffer module serves as an intermediary element between the cutting line and the wiring assemblies. It intercepts the harmful impact forces from removed surplus materials and redirects them to the purging areas and metal sheets, preventing direct transmission of impact forces to the wiring assemblies and thin protection layer
2Ease of operation
If the cutting line is positioned above the wiring assemblies to access the connection area, then the driver IC connection is enabled, but the wiring assemblies are directly exposed to impact from surplus materials being removed
Solution Approach 1:
The buffer module is strategically positioned as an intermediary between the cutting line and the wiring assemblies. It intercepts impact forces from surplus materials during removal, redirecting them to safe areas (purging areas and metal sheets) while allowing the cutting line to maintain its necessary position above the wiring assemblies for driver IC connection access
Solution Approach 2:
The buffer module converts the harmful impact forces from surplus material removal into a beneficial protective function. By absorbing and redirecting these impact forces to the purging areas and metal sheets, the buffer module transforms what would be damaging forces into a controlled energy dissipation mechanism that protects the wiring assemblies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer module effectively absorbs and redirects the impact of surplus materials, preventing damage to the wiring assemblies and improving the yield rate by distributing the force to the purging areas and metal sheets, thus enhancing the reliability of the manufacturing process.
Implementation Method 1
The buffer module effectively absorbs and redirects the impact of surplus materials, preventing damage to the wiring assemblies
Data Source
AI summary
A thin film transistor substrate, capable of being assembled, is attached to a filter substrate to provide a semi-finished liquid crystal display panel. The thin film transistor substrate includes a base substrate with thin film transistors formed thereon, wiring assemblies formed on the substrate and electrically connected to the corresponding thin film transistors selectively, metal sheets formed on the base substrate, a protection layer formed on the thin film transistors, the wiring assemblies, and the metal sheets, and a buffer module formed on the protection layer. The buffer module is positioned above a projection of a cutting line onto the base substrate, and the surplus materials of the filter substrate are removed along the cutting line.