Thin Film Transistor Channel Formation via Embossing Template
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Solution Overview
Problem
Conventional methods for forming semiconductor channel layers in thin film transistors often result in surface erosion due to direct contact with photoresist layers, affecting device performance.
Innovation Solution
A manufacturing method using an embossing template with recess portions to form semiconductor channel layers directly on the source and drain electrode layers, avoiding photolithography and subsequent photoresist layer contact, which includes pre-curing the semiconductor solution material and aligning the embossing template under vacuum conditions to create protrusions in the shape of the recess portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photolithography method is used to form semiconductor channel layer, then manufacturing process can be implemented, but surface of semiconductor layer is eroded due to direct contact with photoresist layer
Solution Approach 1:
The patent introduces an embossing template as an intermediary tool to transfer the semiconductor channel layer pattern. The template has recess portions that define the channel layer shape, allowing the semiconductor material to be deposited only in these recess areas. This eliminates the need for photoresist layers and their associated erosion problems, while still achieving precise pattern formation through the template's physical structure.
2Ease of manufacture
If photolithography method is used with photoresist layer, then pattern formation is achieved, but device performance deteriorates due to eroded semiconductor surface affecting contact with dielectric insulation layer
Solution Approach 1:
The embossing template serves as a mediator that transfers the pattern without causing surface damage. By using the template's recess portions to physically define the pattern boundaries during material deposition, the method achieves precise pattern formation while keeping the semiconductor surface intact, thereby ensuring good contact with the dielectric insulation layer and maintaining device performance.
Solution Approach 2:
The patent uses the embossing template to copy the desired semiconductor channel layer pattern onto the substrate. The recess portions of the template create a negative impression that defines the channel layer shape. This copying mechanism allows precise pattern reproduction without the harmful effects of photoresist, as the template itself directly shapes the semiconductor material through physical contact during deposition.
3Ease of manufacture
If conventional photolithography process is used, then semiconductor channel layer can be formed, but material costs increase due to consumption of photoresist and other chemicals
Solution Approach 1:
The embossing template acts as a reusable intermediary tool that replaces consumable photoresist materials. The template can be used repeatedly to transfer the pattern, eliminating the need for continuous photoresist application and removal cycles. This significantly reduces material consumption and associated costs, while still achieving precise semiconductor channel layer formation.
Solution Approach 2:
The patent implements a process where the embossing template is recovered and reused across multiple manufacturing cycles. Instead of discarding photoresist after a single use, the durable template maintains its pattern-defining recess portions and can be used repeatedly, thereby recovering a significant material investment and reducing ongoing material costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents surface erosion of the semiconductor channel layer, improves device performance by enhancing the contact between the semiconductor channel layer and the dielectric insulation layer, and reduces material costs by eliminating the need for photoresist and allowing for reusable embossing templates.
Implementation Method 1
the recess portions of the embossing template are aligned with the predetermined position under vacuum conditions; the embossing template is pressed onto the pre-cured semiconductor solution material under vacuum conditions
Implementation Method 2
The semiconductor solution material is pre-cured
Implementation Method 3
The protrusions are cured and the embossing template and the baseplate are separated to form the semiconductor channel layer
Data Source
AI summary
The present disclosure provides a manufacturing method for thin film transistors and a display panel, in which a semiconductor channel layer is formed by embossing on a semiconductor solution material directly by using an embossing template having a semiconductor channel layer pattern, thus it does not need to form a photoresist layer on the semiconductor solution material to form a semiconductor channel layer, the erosion of the semiconductor channel layer caused by the photoresist can be avoided, thereby the product quality and the device performance are improved.