TFT Substrate Disconnection Prevention Member
Solution Overview
Problem
The integration of the gate driver into the thin film transistor array panel in display devices leads to lower etching uniformity, causing reverse-tapering of connection signal lines, which can result in disconnection of the connection assistance member, increasing costs and process time.
Innovation Solution
A disconnection prevention member is formed on the side surface of the connection signal lines in the peripheral area, overlapping the connection signal lines and acting as a base for a connection assistance member made of ITO or IZO, ensuring stable connection between the driving and connection signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the gate driver is integrated into the thin film transistor array panel, then the overall size of the display device is reduced and productivity is improved, but the etching uniformity deteriorates causing reverse-tapering of connection signal lines
Solution Approach 1:
A disconnection prevention member is introduced as an intermediary component between the connection signal line and the connection assistance member. This member has a specific shape with a bottom surface that matches the reverse-tapered side surface of the connection signal line, allowing the connection assistance member to be stably positioned without requiring increased IZO thickness, thus preventing disconnection while maintaining etching uniformity
2Reliability
If the thickness of indium zinc oxide is increased to prevent disconnection, then the connection assistance member remains connected, but the cost and process time increase
Solution Approach 1:
The disconnection prevention member is designed with a specific local geometry - a bottom surface that conforms to the reverse-tapered shape of the connection signal line. This localized structural adaptation allows the connection assistance member to maintain stable connection through proper geometric matching rather than increasing material thickness, avoiding additional process time and cost
3Reliability
If the thickness of indium zinc oxide is increased to prevent disconnection, then the connection assistance member remains connected, but the cost increases
Solution Approach 1:
The disconnection prevention member is designed with a specific local geometry - a bottom surface that conforms to the reverse-tapered shape of the connection signal line. This localized structural adaptation allows the connection assistance member to maintain stable connection through proper geometric matching rather than increasing material thickness, avoiding additional process time and cost
Data Source
AI summary
A thin film transistor array panel including a display area having a gate line, a data line insulated from and intersecting the gate line, a thin film transistor connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor, and a peripheral area formed on the circumference of the display area, according to an exemplary embodiment of the present invention, includes: a driving signal line formed with the same layer as the gate line in the peripheral area and receiving an external signal; a connection signal line formed with the same layer as the data line in the peripheral area; a disconnection prevention member overlapping the side surface of the connection signal line on the connection signal line; and a connection assistance member formed on the disconnection prevention member and connecting the driving signal line and the connection signal line.