TFT Electrode Concave Segmentation for Residue Control
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Solution Overview
Problem
In thin film transistor liquid crystal display (TFT-LCD) devices, the thermal expansion of photoresist during the baking process leads to uneven thickness distribution and residue issues, causing short-circuiting defects due to the large surface area of connecting lines and metallic material residues at channel locations.
Innovation Solution
A thin film transistor device is designed with a first and second electrode spaced apart by a concave portion, where the connecting line is formed in the same layer, reducing the surface area and minimizing the influence of photoresist thermal expansion, thereby alleviating residue issues and preventing short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connecting line has a large surface area to ensure electrical connection, then the electrical conductivity is improved, but the photoresist thermal expansion causes uneven thickness distribution and residue issues leading to short-circuiting defects
Solution Approach 1:
The connecting line is divided into multiple segments by introducing concave portions, which reduces the continuous surface area of photoresist material. This segmentation prevents uniform thermal expansion across the entire connecting line, thereby reducing residue formation and short-circuiting defects while maintaining electrical connectivity through each segment.
Solution Approach 2:
The connecting line is transformed from a simple linear structure to a multi-dimensional structure with concave portions that create varying thickness regions. This dimensional change allows different parts of the connecting line to have different photoresist thicknesses, accommodating thermal expansion differently across the structure and preventing uniform defect formation.
2Manufacturing precision
If the connecting line surface area is reduced to minimize photoresist thermal expansion influence, then manufacturing precision is improved, but the electrical connection between electrodes may be compromised
Solution Approach 1:
The connecting line is divided into multiple segments by introducing concave portions, which reduces the continuous surface area of photoresist material. This segmentation prevents uniform thermal expansion across the entire connecting line, thereby reducing residue formation and short-circuiting defects while maintaining electrical connectivity through each segment.
Solution Approach 2:
Multiple connecting segments are combined to form the complete electrical connection path between electrodes. Each segment maintains sufficient conductivity, and their series combination ensures overall electrical connection reliability while the total photoresist surface area is reduced compared to a single continuous connecting line.
3Reliability
If the connecting line has large surface area, then electrical conductivity is improved, but metallic material residues at channel locations increase causing short-circuiting defects
Solution Approach 1:
The connecting line is divided into multiple segments by introducing concave portions, which reduces the continuous surface area of photoresist material. This segmentation prevents uniform thermal expansion across the entire connecting line, thereby reducing residue formation and short-circuiting defects while maintaining electrical connectivity through each segment.
Solution Approach 2:
The concave portions in the connecting line, which reduce the photoresist surface area and prevent short-circuiting, are intentionally designed to create controlled regions that manage metallic material distribution. By converting the potential harm of large surface area into the benefit of reduced residue formation, the design prevents short-circuiting while maintaining necessary electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases the risk of short-circuiting defects by reducing the photoresist thickness influence and metallic material residues at channel locations, enhancing the reliability of TFT-LCD devices.
Implementation Method 1
the thermal expansion of photoresist during the baking process leads to uneven thickness distribution and residue issues
Data Source
AI summary
A thin film transistor device and a method for preparing the same, an array substrate and a display device are disclosed. The thin film transistor device includes a first thin film transistor and a second thin film transistor coupled with each other. A first electrode of the first thin film transistor, a second electrode of the second thin film transistor, and a connecting line therebetween which is configured to couple the first electrode and the second electrode, are formed in a same layer, with each end of the connecting line being connected between respective ends of the first electrode and the second electrode opposite to each other. In the thin film transistor device, the first electrode and the second electrode are spaced apart from each other by a concave portion which is recessed in a region therebetween.