Thin-Film Transistor Layout With Gaps for Adhesive Light Curing
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Solution Overview
Problem
The adhesion of adhesive materials used to bond driving substrates in electronic devices is inadequate, leading to a risk of peeling, which needs to be improved.
Innovation Solution
A thin film transistor is divided into multiple active blocks connected by bridges, with gaps between them allowing light to cure adhesive material more effectively, enhancing adhesion and reducing peeling risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive material is used to bond driving substrates, then bonding is achieved, but adhesion is inadequate leading to peeling risk
Solution Approach 1:
The thin film transistor is divided into multiple active blocks (first active block, second active block, third active block) that are separated by gaps. These gaps allow light to penetrate through and cure the adhesive material more effectively, creating stronger bonds between the driving substrate and opposing substrate while reducing peeling risk at the edges.
2Reliability
If gaps are introduced between active blocks, then light can cure adhesive more effectively, but device structure becomes more complex
Solution Approach 1:
The transistor is segmented into multiple active blocks with gaps between them. This segmentation serves dual purposes: it allows light to reach the adhesive material for effective curing, and the gaps are integrated into the overall transistor design rather than being added as separate features, thus managing structural complexity.
Solution Approach 2:
The gaps between active blocks serve multiple functions: they allow light penetration for adhesive curing, maintains electrical isolation between active blocks, and are incorporated into the transistor's active area design. This multi-functionality reduces the need for additional structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the area of cured adhesive material, improving bonding strength and reducing the likelihood of substrate peeling, thereby enhancing the reliability of electronic devices.
Implementation Method 1
gaps between them allowing light to cure adhesive material more effectively, enhancing adhesion and reducing peeling risk
Data Source
AI summary
A driving substrate is provided. The driving substrate includes a substrate and a thin film transistor disposed on the substrate. The thin film transistor includes a first metal layer, a second metal layer, and a semiconductor. The first metal layer has a first portion, a second portion, and a first bridge. The second metal layer has a third portion, a fourth portion, and a second bridge. The first metal layer is overlapped with the second metal layer and the semiconductor. In a top view, the first portion and the second portion are separated by a first gap and are connected by the first bridge, the third portion and the fourth portion are separated by the first gap and are connected by the second bridge.