TFT Array Substrate Vertical Insertion Structure
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Solution Overview
Problem
Conventional TFT array substrates face issues with weak adhesion between functional layers, leading to potential separation and peeling problems, especially when bent, which affects product stability and display performance.
Innovation Solution
A novel inter-layer structure is introduced, featuring a vertical insertion in the planarization layer with horizontal extensions, enhancing bonding between layers through a combination of vertical and horizontal wedge-shaped structures, thereby improving adhesion and stability even under bending conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a through hole with a plug structure is added to enhance bonding between the planarization layer and interlayer dielectric layer, then the adhesion between layers is improved, but the structure complexity increases and the plug structure becomes easily extracted during bending
Solution Approach 1:
The invention transitions from a single vertical plug structure to a three-dimensional insertion structure that extends in multiple directions (vertical and horizontal). The insertion protrudes from the planarization layer into the function layer, creating a multi-dimensional bonding interface that prevents layer separation more effectively than conventional vertical plugs while maintaining structural simplicity.
Solution Approach 2:
The insertion structure is divided into multiple functional segments: a vertical portion extending downward into the function layer and horizontal portions extending outward. This segmentation allows each part to perform specific functions - the vertical portion provides deep anchoring while horizontal portions prevent lateral displacement, collectively enhancing adhesion without requiring excessive complexity.
2Ease of manufacture
If conventional planar surface contact is used between functional layers, then the manufacturing process is simple, but the bonding force between layers is weak leading to peeling
Solution Approach 1:
Rather than changing the entire planarization layer surface, the invention introduces localized insertions at specific positions where bonding is critical. These insertions create localized three-dimensional bonding interfaces that significantly enhance adhesion strength at key locations while maintaining the overall simplicity of the planar manufacturing process for the majority of the layer.
3Adaptability or versatility
If the TFT array substrate is bent, then the adaptability to flexible applications is improved, but the risk of detachment between different layers increases significantly
Solution Approach 1:
The multi-dimensional insertion structure (combining vertical and horizontal extensions) creates a three-dimensional bonding network that resists detachment forces from bending. The horizontal portions of the insertion extend laterally to anchor adjacent layers, preventing delamination that typically occurs during flexing, while the vertical portion maintains deep anchoring. This multi-directional anchoring system enables the substrate to bend without compromising layer stability.
Data Source
AI summary
The present invention provides a thin film transistor (TFT) array substrate including a base layer. A function layer is disposed on the base layer, and a planarization layer is disposed on the function layer. The planarization layer includes a vertical insertion extending into the function layer, and a side of the vertical insertion horizontally extends outwardly into the function layer to from a horizontal insertion. The invention provides a TFT array substrate, which adopts a novel inter-layers structure arrangement, which effectively reduces risk of potential mutual detachment between different layers, thereby improving product stability.