TFT Metal Electrode Patterning via DIW Stripping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional TFT manufacturing processes involving metal electrodes are prone to copper ion aggregation during etching, leading to overheating and explosion risks, and result in high costs due to the use of etching solutions and waste disposal issues, which negatively impact electrical performance.
Innovation Solution
A manufacturing method that forms metal electrodes without an etching process by using a deionization (DIW) stripping process and interleaved transfer layers to pattern and peel off metal layers, thereby avoiding copper ion aggregation and omitting the need for etching solutions and waste disposal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching process is used to form metal electrodes, then metal electrode pattern can be obtained, but copper ion aggregation occurs leading to overheating and explosion risks
Solution Approach 1:
The patent extracts and removes the harmful etching process from the manufacturing flow. Instead of using chemical etching to pattern metal electrodes, the invention employs a transfer printing method where a pre-patterned metal layer is transferred directly to the substrate through a transfer layer, completely eliminating copper ion aggregation and associated safety hazards
Solution Approach 2:
The patent introduces a transfer layer as an intermediary between the metal layer and the substrate. This transfer layer enables the metal pattern to be transferred without direct contact between etching chemicals and the metal, thereby avoiding copper ion aggregation while achieving precise metal electrode patterning
2Manufacturing precision
If conventional etching process is used to form metal electrodes, then metal electrode can be formed, but TFT electrical performance deteriorates
Solution Approach 1:
The patent removes the etching process entirely from the manufacturing sequence. By using transfer printing instead of etching, the metal electrodes are formed without exposure to harsh chemicals that would otherwise damage the TFT structure and degrade electrical performance
Solution Approach 2:
The metal layer is pre-patterned on the transfer layer before transfer to the substrate. This preliminary patterning allows precise metal electrode formation without requiring subsequent etching steps that would compromise TFT electrical characteristics
3Manufacturing precision
If conventional etching process with multiple solutions is used, then metal electrode pattern can be achieved, but manufacturing cost increases due to waste disposal
Solution Approach 1:
The patent extracts and eliminates the need for multiple etching solutions and associated waste disposal systems. The transfer printing method requires only the transfer layer and metal layer formation, removing all chemical etching steps and their corresponding waste management costs
Solution Approach 2:
The transfer layer serves as a temporary carrier that is discarded after transferring the metal pattern to the substrate. This approach eliminates the need for expensive etching chemicals and their waste disposal, as the only material removed is the inert transfer layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the risk of overheating and explosion, improves TFT electrical performance, and decreases manufacturing costs by eliminating the need for etching solutions and associated waste disposal.
Implementation Method 1
conducting a deionization (DIW) stripping process to peel off the first transfer layer and the first metal layer within the first area from the substrate
Data Source
AI summary
The present disclosure relates to a manufacturing method of thin film transistors (TFTs) and a manufacturing method of array substrates. The manufacturing method includes: forming transfer layers interleaved with each other on a substrate; forming a metal layer on the transfer layer, wherein the metal layer covers the substrate; conducting a deionization (DIW) stripping process to peel off the transfer layer and the metal layer from the substrate, and preserving the metal layer, wherein the metal layer is arranged out of the top of the transfer layer, on the substrate to form a metal electrode of the TFT.