TFT Semiconductor Package Layout for Thin Flexible Wearables

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Solution Overview

Problem

Wearable electronic components face challenges due to increased size and weight when integrating additional functions, such as GPS and heart rate sensing modules, which adversely affect user experience.

Innovation Solution

A semiconductor device package design featuring a main substrate with a TFT module, electronic components, encapsulant, and light emitting devices, connected via conductive vias, allowing for a compact and flexible structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If additional functional modules (GPS, heart rate sensing) are integrated into the housing, then the functionality and versatility of the wearable device are improved, but the size and weight of the housing increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidhousing weight

Core Design Contradiction:

Adaptability or versatilityVSWeight of stationary object

Solution Approach 1:

The patent combines multiple functional modules (display, sensors, electronics) onto a single substrate, integrating them into a unified package structure. This merging approach allows multiple functions to coexist in a compact form factor, improving versatility without proportionally increasing housing weight

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a layered package structure where components are stacked and nested within each other (substrate, encapsulant, additional layers). This nesting arrangement maximizes space utilization, allowing functional modules to be packed densely without increasing the overall footprint or weight significantly

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

Engineering Contradiction:

ImprovefunctionalityVSAvoidhousing size

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent transitions from a planar arrangement of components to a three-dimensional stacked architecture. By utilizing vertical space through multiple layers (substrate, encapsulant, additional layers), the design accommodates more functionality without increasing the horizontal footprint, thus avoiding housing size expansion

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Length of stationary object

If the device housing is made smaller to maintain wearable comfort, then the size constraint is improved, but the ability to integrate additional functional modules is reduced

Engineering Contradiction:

Improvehousing sizeVSAvoidfunctional integration

Core Design Contradiction:

Length of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent utilizes thin-film substrate and encapsulant layers that provide structural integrity while occupying minimal space. These thin-film structures enable the housing to remain compact while still accommodating multiple functional modules through efficient vertical stacking, reconciling small size with high functional integration

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS20250344505A1Semiconductor device package and method of manufacturing the same

Publication Date: 2025.11.06 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.