TFT Array Substrate Stack Structure for Contact Hole Fabrication

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Solution Overview

Problem

Current etching techniques struggle to fabricate contact holes with high aspect ratios on color resist in LCDs, leading to a dilemma where contact holes must be designed with large areas to ensure yield, which negatively impacts pixel aperture ratio and display brightness.

Innovation Solution

A TFT array substrate design that uses a stack structure to raise the extended electrode of the drain electrode, allowing the contact hole to be less deep and smaller in area, thereby promoting the pixel aperture ratio without compromising the etching process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the area of the contact hole is made smaller to increase pixel aperture ratio, then the pixel aperture ratio is improved, but the contact hole cannot pass through the insulation layer smoothly due to etching technique limitations

Engineering Contradiction:
Improvepixel aperture ratioVSAvoidcontact hole fabrication
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent introduces a stack structure that raises the extended electrode of the drain electrode vertically, changing the spatial dimension of the contact hole position. This allows the contact hole to be shallower and smaller in area while still reaching the extended electrode, thereby increasing the pixel aperture ratio without compromising manufacturing feasibility

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The extended electrode acts as an intermediary element between the drain electrode and the pixel electrode. By extending the drain electrode and raising it through the stack structure, it creates an intermediate contact point that is more accessible to etching processes, enabling smaller contact holes to successfully reach the conductive layer

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the contact hole area is made larger to ensure smooth etching process, then the manufacturing precision is improved, but the pixel aperture ratio is reduced

Engineering Contradiction:
Improvecontact hole fabricationVSAvoidpixel aperture ratio
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

By raising the extended electrode through the stack structure, the contact hole needs to traverse less insulation layer depth, allowing for smaller contact hole area while maintaining etching process reliability. This dimensional change decouples the relationship between contact hole size and etching difficulty

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8455877B2Thin film transistor array substrate
Publication Date: 2013.06.04 AU OPTRONICS CORP
  • US8455877B2 patent drawing
  • US8455877B2 patent drawing
  • US8455877B2 patent drawing

AI summary

A thin film transistor (TFT) array substrate includes a stack structure disposed to raise an extended electrode of a drain electrode of a thin film transistor. Therefore, a contact hole does need to be very deep to expose the extended electrode of the drain electrode.