Thin Film Transistor Substrate Capping Layer Uniformity

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Solution Overview

Problem

Conventional thin film transistor substrates with crystalline silicon layers often result in non-uniform transistor characteristics, leading to display apparatuses that exhibit uneven image luminance when the same electrical signal is applied to pixels.

Innovation Solution

A thin film transistor substrate is designed with a crystalline silicon layer covered by a capping layer having varying thickness portions, where a laser beam is irradiated to selectively crystallize the amorphous silicon layer, improving mobility characteristics and uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional crystalline silicon layer is formed with uniform thickness, then the manufacturing process is simple, but the transistor characteristics are non-uniform leading to uneven image luminance

Engineering Contradiction:
Improveuniformity of transistor characteristicsVSAvoidstructure of capping layer
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The capping layer is designed with different thicknesses in different regions (first thickness in first region, second thickness greater than first thickness in second region). This local variation in capping layer thickness creates different heating rates during laser irradiation, resulting in controlled non-uniform crystallization of the amorphous silicon layer that improves transistor characteristic uniformity across the substrate.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If laser beam irradiation is applied to crystallize the amorphous silicon layer, then mobility characteristics are improved, but the crystallization uniformity is poor leading to non-uniform transistor characteristics

Engineering Contradiction:
Improveuniformity of crystalline silicon layerVSAvoidcrystallization process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The thickness parameter of the capping layer is deliberately changed across different regions of the substrate. This parameter variation controls the heating rate and temperature distribution during laser irradiation, enabling uniform crystallization of the amorphous silicon layer into crystalline silicon with consistent mobility characteristics across the entire substrate.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach results in a crystalline silicon layer with enhanced mobility and uniform off-current characteristics, enabling better control over pixel operations and higher quality image display.

Implementation Method 1

a laser beam is irradiated to selectively crystallize the amorphous silicon layer

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

converting the amorphous silicon layer into a crystalline silicon layer

Methodology Applied
Scientific EffectCrystallization: Crystallisation

Data Source

PatentUS9647089B2Thin film transistor substrate, display apparatus including the same, method of manufacturing thin film transistor substrate, and method of manufacturing display apparatus
Publication Date: 2017.05.09 SAMSUNG DISPLAY CO LTD
  • US9647089B2 patent drawing
  • US9647089B2 patent drawing
  • US9647089B2 patent drawing

AI summary

Thin film transistor substrate includes: a substrate; a crystalline silicon layer on the substrate; and a capping layer covering the crystalline silicon layer and including a first portion having a first thickness and a second portion having a second thickness that is greater than the first thickness.