TFT Substrate Filling Layers for Emission Layer Uniformity
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Solution Overview
Problem
In organic light-emitting display apparatuses, non-uniform thickness of the intermediate layer (EML) leads to unsatisfactory image display quality due to varying luminance.
Innovation Solution
A thin-film transistor (TFT) substrate with a specific electrical wiring structure and filling layers formed using different materials, where the filling layers are convex towards the pixel electrode and have varying thicknesses to ensure uniform thickness of the emission layer, which is achieved through inkjet printing and deposition processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the intermediate layer or EML has non-uniform thickness, then the manufacturing process is simpler, but the luminance uniformity deteriorates
Solution Approach 1:
The patent applies preliminary action by forming filling layers between insulating layers before forming the emission layer. These filling layers are specifically designed to compensate for thickness variations that would otherwise occur in the emission layer, ensuring uniform thickness without complicating the emission layer formation process itself.
Solution Approach 2:
The patent implements local quality by creating filling layers with different thicknesses in different regions of the substrate. The filling layers are positioned to provide localized thickness compensation, with varying material compositions and thickness profiles tailored to specific areas to achieve overall emission layer uniformity.
2Manufacturing precision
If filling layers with varying thicknesses are introduced, then the emission layer thickness uniformity improves, but the device structure complexity increases
Solution Approach 1:
The patent applies parameter changes by varying the thickness, material composition, and spatial distribution of the filling layers. These parameter variations are carefully controlled to compensate for substrate and insulating layer thickness variations, enabling uniform emission layer formation through precise parameter optimization rather than structural complexity.
Solution Approach 2:
The filling layers serve as intermediary elements between the insulating layers and the emission layer. They mediate the thickness variations from the lower layers, providing a uniform foundation for the emission layer without requiring direct modification of the emission layer formation process or the underlying substrate structure.
Data Source
AI summary
A thin-film transistor substrate may include an electrical wiring structure that includes a first electrode, which may be a source electrode, a drain electrode, or a capacitor electrode. The thin-film transistor substrate may further include a first insulating layer that directly contacts a first side of the first electrode. The thin-film transistor substrate may further include a second insulating layer that directly contacts a second side of the first electrode opposite the first side of the first electrode. The thin-film transistor substrate may further include a first filling layer that is disposed between the first insulating layer and the second insulating layer.