Thin Film Transistor Substrate With Integrated Data Line And Light Barrier
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Solution Overview
Problem
The high cost and complexity of fabricating liquid crystal display devices are exacerbated by the need for multiple passivation films, which increase parasitic capacitance and require additional masking processes, making it difficult to produce slim and cost-effective thin film transistor substrates.
Innovation Solution
A thin film transistor substrate is fabricated with a data line and light barrier film formed on the same plane, eliminating the need for an organic passivation film and reducing the number of masking processes by integrating the data line and light barrier film formation, thereby minimizing parasitic capacitance and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an organic passivation film is formed to isolate the common electrode and data line, then parasitic capacitance is reduced, but the thickness of the substrate increases and fabrication cost increases
Solution Approach 1:
The patent removes the organic passivation film from the structure entirely. Instead of using a thick organic layer to isolate the common electrode and data line, the invention relies on the inherent insulation properties of the inorganic passivation film and the spatial arrangement where the data line is formed on the same plane as the light barrier film, eliminating the need for additional thick organic isolation layers.
Solution Approach 2:
The patent changes the dimensional arrangement by forming the data line on the same plane as the light barrier film rather than stacking it above or below with additional passivation layers. This planar arrangement reduces the vertical thickness while maintaining electrical isolation through the inorganic passivation film structure.
2Reliability
If multiple passivation films are used to isolate electrodes, then electrical isolation is improved, but the number of masking processes increases and fabrication complexity increases
Solution Approach 1:
The patent merges the functions of multiple passivation films into a single integrated inorganic passivation film structure. The inorganic passivation film serves multiple isolation functions simultaneously, eliminating the need for separate organic passivation films and reducing the number of masking processes required for pattern formation.
Solution Approach 2:
The inorganic passivation film is designed to perform multiple functions: electrical isolation between electrodes, mechanical protection, and structural support. This multi-functional approach replaces the need for multiple specialized films, simplifying the fabrication process while maintaining reliable electrical isolation.
3Object-affected harmful factors
If the thickness of the organic passivation film is increased to reduce parasitic capacitance, then parasitic capacitance is reduced, but fabrication cost increases and device slimness is compromised
Solution Approach 1:
The patent replaces expensive, thick organic passivation films with a thinner, more cost-effective inorganic passivation film structure. The inorganic film achieves the required electrical isolation and parasitic capacitance reduction without the high material and processing costs associated with thick organic layers.
Data Source
AI summary
A thin film transistor substrate according to an embodiment includes a data line and a light barrier film to overlap an active layer of a thin film transistor, wherein the data line and the light barrier film are formed simultaneously, thereby reducing the cost of fabricating the thin film transistor substrate.