Thin Film Transistor Substrate Moisture Barrier Design
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Solution Overview
Problem
Liquid crystal display panels with organic and inorganic insulating layers experience peeling issues due to moisture ingress at the interface between these layers, particularly under high temperature and humidity conditions, leading to discoloration and degradation of anisotropic conductive films near terminals.
Innovation Solution
A thin film transistor substrate design that includes a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer where the organic insulating layer's sides are covered by the second inorganic insulating layer, enhancing moisture barrier properties and preventing peeling by ensuring the organic insulating layer is fully encapsulated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an organic insulating layer is stacked on an inorganic insulating layer, then the insulating performance is improved, but moisture ingress causes peeling at the interface
Solution Approach 1:
A protective film is formed on the organic insulating layer to cover and protect the side surface of the organic insulating layer. This protective film acts as a barrier that prevents moisture from reaching the interface between the organic and inorganic insulating layers, thereby preventing peeling while maintaining the insulating performance of the multilayer structure.
Solution Approach 2:
The protective film serves as an intermediary barrier between the external environment (moisture) and the interface between the organic and inorganic insulating layers. By introducing this intermediate protective layer, moisture ingress is blocked before it can cause peeling at the critical interface, resolving the contradiction between maintaining insulating performance and ensuring interface stability.
2Ease of manufacture
If the organic insulating layer is exposed on the sides, then manufacturing is simplified, but moisture enters from exposed sides causing peeling
Solution Approach 1:
A protective film is formed that extends to cover the side surface of the organic insulating layer. This protective film creates a complete enclosure that prevents moisture from entering from the exposed sides, thereby improving reliability without significantly complicating the manufacturing process, as the protective film can be formed as a continuous layer over the existing structure.
3Stability of the object's composition
If inorganic insulating layers formed of silicon oxide are used, then oxygen loss of oxide semiconductor is reduced, but adhesion with organic insulating layer deteriorates
Solution Approach 1:
The protective film acts as an intermediary layer between the organic insulating layer and the external environment. It compensates for the poor adhesion between the silicon oxide inorganic insulating layer and the organic insulating layer by providing an additional protective barrier that prevents moisture from exploiting the weak adhesion interface, thus maintaining both oxide semiconductor stability and overall structure integrity.
Solution Approach 2:
The structure employs a composite multilayer configuration including inorganic insulating layers (silicon oxide), organic insulating layer, and protective film. This composite structure leverages the advantages of each material: silicon oxide for reducing oxygen loss in oxide semiconductors, and the protective film for providing moisture barrier and adhesion compensation, thereby resolving the contradiction between oxide semiconductor stability and adhesion strength.
Data Source
AI summary
The present invention provides a thin film transistor substrate and a display device that prevent peeling. The thin film transistor substrate includes: an insulating substrate; a thin film transistor; a first inorganic insulating layer; an organic insulating layer stacked on the first inorganic insulating layer; and a second inorganic insulating layer stacked on the organic insulating layer. The organic insulating layer includes a side covered with the second inorganic insulating layer. The first inorganic insulating layer may contain silicon oxide. The organic insulating layer may contain photosensitive resin. The second inorganic insulating layer may contain silicon nitride.