Non-Rectangular TFT Substrate Terminal Protection
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Solution Overview
Problem
Conventional liquid crystal display device manufacturing methods risk corrosion of terminal portions due to damage from laser beam irradiation, leading to potential gaps and exposure to etching solutions during the etching process.
Innovation Solution
A method involving the formation of annular seal members around terminal and overlapping regions, with a non-overlapping part having a non-rectangular shape to prevent laser beam damage and ensure protection during etching, allowing for controlled separation and reduced risk of corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the region is irradiated with laser beam so as to overlap with the etching resistant seal in planar view, then the segmentation is achieved, but the etching resistant seal is damaged and gaps are generated between the seal and substrates
Solution Approach 1:
The patent divides the sealing structure into two distinct parts: an etching resistant seal for protecting terminal portions during etching, and a liquid crystal seal for bonding substrates and containing liquid crystal. This segmentation allows each seal to perform its specific function without interfering with the other, particularly preventing laser beam damage to the etching resistant seal while maintaining effective terminal protection.
Solution Approach 2:
The patent introduces a non-overlapping part of the thin film transistor substrate that extends beyond the counter substrate boundary. This non-overlapping part serves as an intermediary structure that positions the terminal portions in a region not requiring laser beam irradiation, thereby protecting the etching resistant seal from laser damage while maintaining its protective function over the terminal portions.
2Productivity
If the etching resistant seal is damaged by laser beam irradiation, then segmentation can proceed, but the etching solution enters through gaps and corrodes the terminal portion
Solution Approach 1:
The patent positions the terminal portions on a non-overlapping part of the thin film transistor substrate that extends beyond the counter substrate boundary before the etching process. This preliminary positioning ensures that terminal portions are located in a region that will not be exposed to laser beam irradiation or etching solution during subsequent manufacturing steps, preventing corrosion before it can occur.
Solution Approach 2:
By dividing the substrate structure into overlapping and non-overlapping parts, the patent creates distinct functional zones. The non-overlapping part houses terminal portions protected from harmful factors, while the overlapping part undergoes normal laser beam irradiation and etching processes for segmentation, allowing productivity to be maintained without compromising terminal portion integrity.
3Reliability
If the terminal portion is protected from laser beam irradiation, then corrosion risk is reduced, but the device structure becomes more complex
Solution Approach 1:
The non-overlapping part of the thin film transistor substrate serves multiple functions: it provides structural support, defines the boundary between overlapping and non-overlapping regions, positions terminal portions in protected areas, and facilitates the separation of etching and bonding functions between different seal members. This multi-functionality reduces the need for additional protective structures, thereby limiting complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the risk of terminal portion corrosion by protecting the terminal areas with seal members and optimizing the shape of non-overlapping parts to prevent microcrack formation and stress concentration, thereby enhancing the reliability of the liquid crystal display device manufacturing process.
Implementation Method 1
both the substrates are subjected to a laser beam irradiation step and an etching step
Implementation Method 2
performing wet etching of an outer edge of the entire region
Data Source
AI summary
A liquid crystal display device according to a present disclosure comprises: a thin film transistor substrate including a thin film transistor array; a counter substrate opposed to the thin film transistor substrate; and a liquid crystal layer disposed between the thin film transistor substrate and the counter substrate, wherein the thin film transistor substrate includes: an overlapping part that overlaps with the counter substrate in planar view; and a non-overlapping part that includes a terminal portion and does not overlap with the counter substrate in planar view, and an outer shape of the non-overlapping part has a non-rectangular shape in planar view.