Through-Glass Via Liner Stack for Delamination Control
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Solution Overview
Problem
Conventional liner layers for through glass vias (TGVs) suffer from delamination due to compressive stress, leading to device failure and performance issues.
Innovation Solution
Implementing a combination of an adhesion layer with specific tensile stress and Young's modulus, and a second layer with compressive stress, to create a liner layer stack that prevents delamination by counteracting stress differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PECVD TEOS based SiO liner layer is used to improve adhesion between glass substrate and copper interconnect, then adhesion is improved, but compressive stress causes delamination at TGV corners
Solution Approach 1:
The liner layer is divided into two separate layers: a first liner layer deposited directly on the glass substrate, and a second liner layer deposited on the first liner layer. This segmentation allows each layer to have optimized properties - the first layer provides strong adhesion to glass while the second layer provides tensile stress to counteract compressive stress, preventing delamination at TGV corners.
Solution Approach 2:
The patent changes the stress parameter of the liner layer system by introducing a second layer with tensile stress to counterbalance the compressive stress of the first layer. This parameter adjustment transforms the overall stress state from compressive (causing delamination) to a balanced or tensile state, eliminating the delamination issue while maintaining adhesion benefits.
2Reliability
If liner layer thickness is increased to improve adhesion, then adhesion is improved, but compressive stress increases causing more severe delamination
Solution Approach 1:
The thick liner layer is segmented into two layers with different thicknesses and stress properties. The first layer has optimized thickness for adhesion, while the second layer compensates for stress. This allows achieving sufficient adhesion without the excessive compressive stress that would result from a single thick layer.
Solution Approach 2:
The liner layer system becomes a composite structure with two layers having different mechanical properties. The first layer provides adhesion with controlled compressive stress, while the second layer provides tensile stress compensation. This composite approach allows optimizing both adhesion and stress characteristics separately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed liner layer stack enhances adhesion to the glass substrate, reducing the likelihood of delamination and improving the cohesion and efficiency of semiconductor chip packaging and electronic devices.
Implementation Method 1
depositing an adhesion layer having a thickness of about 100 Angstroms to about 550 Angstroms, a tensile stress of about −30 MPa to about 80 MPa
Implementation Method 2
depositing a second layer onto the adhesion layer, the second layer having a thickness of about 2,000 Angstroms to about 60,000 Angstroms, a compressive stress greater than about −50 MPa
Data Source
AI summary
Implementations of the present disclosure generally relate to liner layers and methods of forming liner layers for through glass vias. In one or more implementations, a liner layer is deposited on a glass substrate having a plurality of vias disposed through the glass substrate. The method includes depositing an adhesion layer onto and in a via of the plurality of vias to form the adhesion layer, the adhesion layer having a thickness of about 100 Angstroms to about 550 Angstroms, a tensile stress of about −30 MPa to about 80 MPa, and a Young's modulus of about 115 GPa to about 200 GPa and depositing a second layer onto the adhesion layer, the second layer having a thickness of about 2,000 Angstroms to about 60,000 Angstroms, a compressive stress greater than about −50 MPa, and a Young's modulus of about 35 GPa to about 70 GPa.