TGV Via Waist Depth Detection Using Oblique Optical Imaging
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Solution Overview
Problem
Conventional methods for detecting the waist depth of through glass vias in TGV substrates are slow, costly, and can damage the substrate, as they often require filling lossless plastic materials or use inefficient X-ray detection.
Innovation Solution
A via waist depth detection device using a first DOF camera and a first collimated light source arranged obliquely above and below the glass substrate, with a microcontroller to capture and analyze images optically, eliminating the need for filling materials and reducing detection time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If X-ray detection is used to measure via waist depth, then measurement capability is achieved, but detection speed is too slow to meet production requirements
Solution Approach 1:
The patent replaces the mechanical/X-ray detection system with an optical detection system using a depth of field camera and collimated light source. This substitution enables non-contact, high-speed optical measurement of via waist depth while maintaining measurement capability, thereby resolving the contradiction between measurement precision and detection speed.
Solution Approach 2:
The patent changes the detection parameter from X-ray attenuation to optical focus depth. By using a depth of field camera with collimated light to detect focus position changes at different via depths, the system achieves rapid measurement without the slow detection speed inherent in X-ray methods.
2Measurement precision
If lossless plastic material is filled into via holes for measurement, then via depth information can be obtained, but extra cost and detection time are required
Solution Approach 1:
The patent extracts and eliminates the unnecessary step of filling lossless plastic material into the via holes. By using direct optical detection on the glass substrate vias, the system obtains via depth information without the time-consuming filling and removal process, thereby reducing detection time while maintaining measurement capability.
Solution Approach 2:
The patent enables the via structure itself to provide measurement information through its optical properties. The collimated light reflects off different via depth positions, allowing the via structure to 'self-report' its depth information optically without requiring external filling materials or additional processing steps.
3Measurement precision
If lossless plastic material is filled into via holes, then measurement can be performed, but additional cost is incurred
Solution Approach 1:
The patent removes the requirement for lossless plastic filling materials from the measurement process. By using direct optical detection, the system eliminates the cost of purchasing, applying, and removing filling materials, thereby reducing manufacturing costs while maintaining via depth measurement capability.
Solution Approach 2:
The patent replaces expensive lossless plastic filling materials with a low-cost optical detection system. The optical method uses inexpensive collimated light sources and standard depth of field cameras, eliminating the need for costly consumable filling materials while achieving the same measurement objective.
4Measurement precision
If conventional detection methods are used, then via depth can be measured, but the substrate may be damaged
Solution Approach 1:
The patent replaces contact-based or high-energy detection methods with non-contact optical detection. The collimated light system measures via waist depth by detecting focus positions of reflected light, completely avoiding mechanical contact or high-energy radiation that could damage the glass substrate, thereby enabling damage-free measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical detection method efficiently determines the waist depth of through glass vias without damaging the substrate, reducing detection time and cost while providing accurate measurements.
Implementation Method 1
use a depth of field (DOF) camera to obliquely capture the glass substrate
Implementation Method 2
a first collimated light source... configured to emit a first collimated beam which obliquely irradiates the glass substrate
Data Source
AI summary
A TGV substrate via waist depth detection device has a first DOF camera, a first collimated light source and microcontroller is illustrated. The first DOF camera and first collimated light source are respectively arranged above and below the glass substrate with at least one glass substrate via, and respectively obliquely face the upper surface and lower surface of the glass substrate. The microcontroller is coupled with the first DOF camera and first collimated light source. The first collimated light source is configured to emit the first collimated beam which obliquely irradiates the glass substrate, the first DOF camera is configured to obtain the first image, and the microcontroller is configured to obtain at least one detection result of at least one glass substrate via according to the first image.