Thermally Conductive Additive Using Metal Coordination Complexes

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Solution Overview

Problem

Existing thermally conductive additives for organic polymers often require high volumes of inorganic fillers, which compromise material strength, insulation properties, and processability due to intermolecular interactions and reduced solubility when highly oriented mesogenic groups are introduced for thermal conductivity enhancement.

Innovation Solution

A thermally conductive additive comprising an organic component with a coordination part that multidentate-coordinates to a metal atom, forming a coordination complex with a metal-containing component, allowing for regular π-π interaction and orientation without excessive irreversible intermolecular interactions, thereby improving thermal conductivity while maintaining high processability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a large amount of thermally conductive filler is added to the organic polymer, then thermal conductivity is improved, but material strength deteriorates and specific gravity increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidmaterial strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The invention changes the chemical composition parameters of the organic polymer by introducing specific functional groups (carboxyl, hydroxyl, or amine groups) that can coordinate with metal atoms. This chemical modification enables the organic polymer to form coordination complexes with metal-containing components, creating new thermal conduction pathways without requiring excessive inorganic filler addition, thus maintaining material strength while improving thermal conductivity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite material system where organic polymer molecules with coordinating functional groups form coordination complexes with metal-containing components. This composite structure combines the benefits of organic polymers (processability, strength) with metal atoms (high thermal conductivity), achieving effective heat dissipation without the drawbacks of adding large amounts of traditional inorganic fillers

Inventive Principle:

Principle #40Composite materials

2Temperature

If highly oriented mesogenic groups are introduced into the organic polymer to increase thermal conductivity, then thermal conductivity is improved, but processability deteriorates due to increased intermolecular interaction and reduced solubility

Engineering Contradiction:

Improvethermal conductivityVSAvoidprocessability

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The invention modifies the molecular structure parameters of the organic polymer by introducing specific functional groups (carboxyl, hydroxyl, or amine groups) that provide controlled coordination capability with metal atoms. This controlled chemical interaction enables thermal conductivity enhancement through coordination complex formation without the excessive intermolecular interactions and solubility reduction associated with highly oriented mesogenic groups, thus maintaining good processability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The metal-containing component acts as an intermediary that mediates between the organic polymer molecules. The metal atoms coordinate with functional groups on organic polymer chains, creating thermal conduction pathways while the organic polymer matrix maintains its solubility and processability. This intermediary approach avoids the direct strong intermolecular interactions that would otherwise occur between highly oriented mesogenic groups

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermally conductive additive effectively enhances thermal conductivity of organic polymers with improved solubility and meltability, reducing the need for high filler volumes and minimizing adverse effects on material properties, such as strength and insulation.

Implementation Method 1

the organic component coordinates at the coordination part to a metal atom constituting the metal-containing component to form a coordination complex

Methodology Applied

Scientific EffectCoordination complex formation: Chemical Bonding

Implementation Method 2

at least one functional group bonded to the coordination part and having a conjugated π-electron system

Methodology Applied

Scientific Effectπ-π interaction: Van der Waals Force

Data Source

PatentUS20230365851A1Thermally conductive additive, thermally conductive composite material, and wire harness

Publication Date: 2023.11.16 AUTONETWORKS TECH LTD

AI summary

A thermally conductive additive is excellent in thermal conductivity improvement effect and has high processability, and a thermally conductive composite material and a wire harness each contain such a thermally conductive additive. The thermally conductive additive includes an organic component and a metal-containing component, where the organic component is configured as an organic compound including a coordination part that can multidentate-coordinate to a metal, and at least one functional group bonded to the coordination part and having a conjugated π-electron system, and the organic component coordinates in the coordination part to a metal atom constituting the metal-containing component to form a coordination complex. The thermally conductive composite material includes the thermally conductive additive and a matrix material, where the thermally conductive additive is dispersed in the matrix material. The wire harness includes the thermally conductive composite material.